PMEG2010EPA NXP Semiconductors, PMEG2010EPA Datasheet - Page 10

• Manufacturer Part Number: PMEG2010EPA
• Description: Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Packing information
11. Soldering
PMEG2010EPA_1
Product data sheet
Table 8.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
PMEG2010EPA SOT1061
Fig 15. Reflow soldering footprint SOT1061
For further information and the availability of packing methods, see
2.3
Reflow soldering is the only recommended soldering method.
Packing methods
1.05
Package
0.6
Rev. 01 — 15 December 2009
0.55
solder paste = solder lands
solder resist
Description
4 mm pitch, 8 mm tape and reel
1 A low V
occupied area
2.1
1.3
0.4
0.5
1.6
1.7
F
0.5 (2×)
0.4 (2×)
MEGA Schottky barrier rectifier
PMEG2010EPA
Section
Dimensions in mm
[1]
14.
0.5 (2×)
sot1061_fr
0.25
0.25
0.25
Packing quantity
3000
-115
© NXP B.V. 2009. All rights reserved.
0.6 (2×)
1.1
1.2
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