LPC2387FBD100 NXP Semiconductors, LPC2387FBD100 Datasheet - Page 62

• Manufacturer Part Number: LPC2387FBD100
• Description: The LPC2387 is an ARM7 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 72 MHz
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Table 19.
LPC2387
Product data sheet
Document ID
LPC2387 v.4
Modifications:
LPC2387 v.3
Modifications:
LPC2387 v.2
LPC2387 v.1
Revision history
Release date
20110210
20081029
20080201
20080114
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Table 3 “Pin description”: Added Table note 9 for XTAL1 and XTAL2 pins.
Table 3 “Pin description”: Added Table note 10 for RTCX1 and RTCX2 pins.
Table 4 “Limiting values”: Changed V
Table 7 “Static characteristics”: Removed R
Table 7 “Static characteristics”, Table note 13: Changed value from 18 to 33.
Table 7 “Static characteristics”: Updated min, typical and max values for oscillator pins.
Table 7 “Static characteristics”: Updated conditions and typical values for I
I
Table 7 “Static characteristics”: Changed I
Section 2 “Features and benefits”: Added deep power-down information.
Section 7.2 “On-chip flash programming memory” “On-chip flash programming memory”:
Removed text regarding flash endurance minimum specs.
Section 7.23 “RTC and battery RAM”: Added deep power-down information.
Section 7.24.2 “PLL”: Changed input clock frequency max to 25 MHz.
Section 7.24.3 “Wake-up timer”: Added deep power-down information.
Section 7.24.4 “Power control”: Added deep power-down information.
Added Section 7.24.4.4 “Deep power-down mode”.
Section 7.25.2 “Brownout detection”: Changed V
Added Section 9 “Thermal characteristics”.
Added Section 10.1 “Power-down mode”.
Added Section 10.2 “Deep power-down mode”.
Added Section 10.3 “Electrical pin characteristics”.
Added Section 11.1 “Internal oscillators”.
Added Section 11.2 “I/O pins”.
Added Section 11.4 “Flash memory”.
Added Section 13 “DAC electrical characteristics”.
Added Section 14.2 “Crystal oscillator XTAL input and component selection”.
Added Section 14.3 “RTC 32 kHz oscillator component selection”.
Added Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”.
Added Section 14.5 “Standard I/O pin configuration”.
Added Section 14.6 “Reset pin configuration”.
Moved Figure 12 “External clock timing (with an amplitude of at least V
below Table 8 “Dynamic characteristics”.
Added USB host/OTG features
Table 4: changed storage temperature range from 40 C/125 C to 65 C/150 C.
Table 6, V
Table 6, V
Table 6: updated Table note 10.
BATact
; added I
hys
I
, added Table note 8.
All information provided in this document is subject to legal disclaimers.
, moved 0.4 from Typ to Min column.
DD(DCDC)dpd(3V3)
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Rev. 5 — 9 January 2012
and I
BAT
ESD
.
min/max to 2500/+2500.
2
C-bus V
pu
.
Change notice
-
-
-
-
DD(3V3)
hys
typical from 0.5V
to V
Single-chip 16-bit/32-bit MCU
DD(DCDC)(3V3)
Supersedes
LPC2387 v.3
LPC2387 v.2
LPC2387 v.1
-
i(RMS)
DD
LPC2387
.
© NXP B.V. 2012. All rights reserved.
DD(DCDC)pd(3V3)
to 0.05V
= 200 mV)” to
DD
.
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