LPC2458 NXP Semiconductors, LPC2458 Datasheet - Page 44

NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace

LPC2458

Manufacturer Part Number
LPC2458
Description
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer
NXP Semiconductors
Datasheet

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9. Thermal characteristics
Table 7.
V
LPC2458
Product data sheet
Symbol
T
DD
j(max)
= 3.0 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 8.
V
T
TFBGA180
ja
JEDEC (4.5 in  4 in)
0 m/s
1 m/s
2.5 m/s
8-layer (4.5 in  3 in)
0 m/s
1 m/s
2.5 m/s
jc
jb
DD
=
j
=
T
R
P
= 3.0 V to 3.6 V; T
40
amb
D
T
th(j-a)
amb
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)
Thermal resistance value (C/W): ±15 %
P
D
All information provided in this document is subject to legal disclaimers.
Conditions
C unless otherwise specified
R
th j a
amb
Rev. 4 — 1 September 2011
=
40
C to +85
C unless otherwise specified
j
(C), can be calculated using the following
45.5
38.3
33.8
38
33.5
29.8
8.9
12
Min
-
DD
and V
DD
Single-chip 16-bit/32-bit micro
Typ
-
. The I/O power dissipation of
Max
125
LPC2458
© NXP B.V. 2011. All rights reserved.
Unit
C
44 of 80
(1)

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