PSMN008-75B NXP Semiconductors, PSMN008-75B Datasheet

SiliconMAX standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology

PSMN008-75B

Manufacturer Part Number
PSMN008-75B
Description
SiliconMAX standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology
Manufacturer
NXP Semiconductors
Datasheet

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1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
SiliconMAX standard level N-channel enhancement mode Field-Effect Transistor (FET) in
a plastic package using TrenchMOS technology. This product is designed and qualified for
use in computing, communications, consumer and industrial applications only.
Table 1.
Symbol Parameter
V
I
P
Dynamic characteristics
Q
Static characteristics
R
D
DS
tot
GD
DSon
Higher operating power due to low
thermal resistance
Low conduction losses due to low
on-state resistance
DC-to-DC convertors
PSMN008-75B
N-channel TrenchMOS SiliconMAX standard level FET
Rev. 04 — 11 December 2009
drain-source voltage T
drain current
total power
dissipation
gate-drain charge
drain-source
on-state resistance
Quick reference
Conditions
T
see
T
V
V
see
V
T
j
mb
mb
j
GS
DS
GS
≥ 25 °C; T
= 25 °C; see
Figure 1
Figure 11
= 25 °C; V
= 25 °C; see
= 60 V; T
= 10 V; I
= 10 V; I
j
D
D
and
≤ 175 °C
j
= 25 °C;
GS
= 75 A;
= 25 A;
Figure 9
3
Figure 2
= 10 V;
Rated for avalanche ruggedness
Suitable for high frequency
applications due to fast switching
characteristics
Uninterruptible power supplies
and
10
Min
-
-
-
-
-
Product data sheet
Typ
-
-
-
50
6.5
Max
75
75
230
-
8.5
Unit
V
A
W
nC
mΩ

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PSMN008-75B Summary of contents

Page 1

... PSMN008-75B N-channel TrenchMOS SiliconMAX standard level FET Rev. 04 — 11 December 2009 1. Product profile 1.1 General description SiliconMAX standard level N-channel enhancement mode Field-Effect Transistor (FET plastic package using TrenchMOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only. ...

Page 2

... Figure °C mb ≤ 10 µs; pulsed ° ° j(init Ω; t unclamped 0.129 Rev. 04 — 11 December 2009 PSMN008-75B Graphic symbol mbb076 Version SOT404 Min Max - - and 3 ...

Page 3

... Fig 2. Normalized total power dissipation as a function of mounting base temperature = 100 μ Rev. 04 — 11 December 2009 PSMN008-75B 03aa16 50 100 150 T (°C) mb 03am79 = 10 μ (V) DS © NXP B.V. 2009. All rights reserved. 200 ...

Page 4

... Transient thermal impedance from junction to mounting base as a function of pulse duration PSMN008-75B_4 Product data sheet N-channel TrenchMOS SiliconMAX standard level FET Conditions see Figure 4 mounted on a printed-circuit board; minimum footprint −3 − Rev. 04 — 11 December 2009 PSMN008-75B Min Typ Max - - 0. 03am78 t p δ = ...

Page 5

... °C G(ext ° see Figure /dt = -100 A/µ ° Rev. 04 — 11 December 2009 PSMN008-75B Min Typ Max Unit 4 0.05 10 µ 500 µ ...

Page 6

... V GS(th) (V) max − (V) GS Fig 8. Gate-source threshold voltage as a function of junction temperature Rev. 04 — 11 December 2009 PSMN008-75B 03am82 V > DSon 175 ° ° (V) GS 03aa32 max typ min 0 ...

Page 7

... C (pF 100 150 10 Q (nC) G Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values Rev. 04 — 11 December 2009 PSMN008-75B 03ac63 0 60 120 T (°C) j 03am84 C iss C oss C rss − (V) DS © ...

Page 8

... Fig 13. Source current as a function of source-drain voltage; typical values PSMN008-75B_4 Product data sheet N-channel TrenchMOS SiliconMAX standard level FET 100 ( 175 ° ° 0 Rev. 04 — 11 December 2009 PSMN008-75B 03am83 1.5 (V) SD © NXP B.V. 2009. All rights reserved ...

Page 9

... N-channel TrenchMOS SiliconMAX standard level FET 2 scale max. 1.60 10.30 2.90 15.80 11 2.54 1.20 9.70 2.10 14.80 REFERENCES JEDEC JEITA Rev. 04 — 11 December 2009 PSMN008-75B mounting base 2.60 2.20 EUROPEAN ISSUE DATE PROJECTION 05-02-11 06-03-16 © NXP B.V. 2009. All rights reserved. SOT404 ...

Page 10

... The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type number PSMN008-75B separated from data sheet PSMN008_75P_75B-03. PSMN008_75P_75B-03 20040108 (9397 750 12545) PSMN008_75P_75B-02 ...

Page 11

... Export might require a prior authorization from national authorities. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. TrenchMOS— trademark of NXP B.V. to:salesaddresses@nxp.com Rev. 04 — 11 December 2009 PSMN008-75B © NXP B.V. 2009. All rights reserved ...

Page 12

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 11 December 2009 Document identifier: PSMN008-75B_4 ...

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