MAX3815CCM+TDG05 Maxim Integrated Products, MAX3815CCM+TDG05 Datasheet - Page 9
![IC EQUALIZER VIDEO 48-TQFP](/photos/6/61/66159/48-tqfp_21-0065g_sml.jpg)
MAX3815CCM+TDG05
Manufacturer Part Number
MAX3815CCM+TDG05
Description
IC EQUALIZER VIDEO 48-TQFP
Manufacturer
Maxim Integrated Products
Type
Video Equalizerr
Datasheet
1.MAX3815CCMTD.pdf
(11 pages)
Specifications of MAX3815CCM+TDG05
Applications
HDMI, DVI, Receivers
Mounting Type
Surface Mount
Package / Case
48-TQFP Exposed Pad, 48-eTQFP, 48-HTQFP, 48-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Figure 6. Cable Reach
within a twisted pair (STP or UTP), usually a result of
cable twist or dielectric imbalance. Refer to Application
Note HFAN-04.5.4: ‘Jitter Happens’ when a Twisted
Pair is Unbalanced for more information.
The data and clock inputs are the most critical paths for
the MAX3815 and great care should be taken to mini-
mize discontinuities on these transmission lines
between the connector and the IC. Here are some sug-
gestions for maximizing the performance of the
MAX3815:
• The data and clock inputs should be wired directly
between the cable connector and IC without stubs.
60
50
40
30
20
10
5
AWG
TMDS Digital Video Equalizer for DVI/HDMI
32
TYPICAL MAX3815 CABLE REACH
_______________________________________________________________________________________
AWG
30
TYPICAL DVI WIRE GAUGE RANGE
DVI WIRE GAUGE
AWG
28
Layout Considerations
AWG
26
AWG
24
AWG
22
(For the latest package outline information, go to
www.maxim-ic.com/packages.)
The exposed pad on the 48-pin TQFP-EP provides a
very low thermal resistance path for heat removal from
the IC. The pad is also electrical ground on the
MAX3815 and must be soldered to the circuit board
ground for proper thermal and electrical performance.
Refer to Maxim Application Note HFAN-08.1: Thermal
Considerations of QFN and Other Exposed-Paddle
Packages for additional information.
PROCESS: SiGe BiPOLAR
• Input and output data channel designations are
• An uninterrupted ground plane should be posi-
• Ground-path vias should be placed close to the IC
• Maintain 100Ω differential transmission line imped-
• Use good high-frequency layout techniques and
only a guide. Polarity assignments can be swapped
and channel paths can be interchanged.
tioned beneath the high-speed I/Os.
and the input/output interfaces to allow a return cur-
rent path to the IC and the DVI cable.
ance into and out of the MAX3815.
multilayer boards with an uninterrupted ground
plane to minimize EMI and crosstalk.
PACKAGE TYPE
48 TQFP
Package Information
Exposed-Pad Package
Chip Information
DOCUMENT NO.
21-0065
Cables
9