FDMS3006SDC Fairchild Semiconductor, FDMS3006SDC Datasheet - Page 3

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FDMS3006SDC

Manufacturer Part Number
FDMS3006SDC
Description
Manufacturer
Fairchild Semiconductor
Datasheet

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©2011 Fairchild Semiconductor Corporation
FDMS3006SDC Rev.C
NOTES:
1. R
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. E
4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied.
5. I
Thermal Characteristics
R
R
R
R
R
R
R
R
R
R
R
R
R
R
the user's board design.
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
SD
AS
θJA
c. Still air, 13x8.1x5.8mm Aluminum Heat Sink, 1 in2 pad of 2 oz copper
d. Still air, 13x8.1x5.8mm Aluminum Heat Sink, minimum pad of 2 oz copper
e. Still air, 25x25x10mm Aavid Thermalloy part#10-6327-01 Heat Sink, 1 in2 pad of 2 oz copper
f. Still air, 25x25x10mm Aavid Thermalloy part#10-6327-01 Heat Sink, minimum pad of 2 oz copper
g. 200FPM Airflow, No Heat Sink,1 in2 pad of 2 oz copper
h. 200FPM Airflow, No Heat Sink, minimum pad of 2 oz copper
i. 200FPM Airflow, 13x8.1x5.8mm Aluminum Heat Sink, 1 in2 pad of 2 oz copper
j. 200FPM Airflow, 13x8.1x5.8mm Aluminum Heat Sink, minimum pad of 2 oz copper
k. 200FPM Airflow, 25x25x10mm Aavid Thermalloy part#10-6327-01 Heat Sink, 1 in2 pad of 2 oz copper
l. 200FPM Airflow, 25x25x10mm Aavid Thermalloy part#10-6327-01 Heat Sink, minimum pad of 2 oz copper
≤ 30 A, di/dt ≤ 165 A/μs, V
of 144 mJ is based on starting T
is determined with the device mounted on a 1 in
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
DD
≤ BV
J
DSS
= 25
, Starting T
°
C, L = 1 mH, I
a. 38 °C/W when mounted on
a 1 in
2
J
2
pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
= 25
pad of 2 oz copper
AS
o
C.
= 17 A, V
DD
= 27 V, V
GS
3
= 10 V. 100% test at L = 0.1 mH, I
(Bottom Drain)
(Top Source)
(Note 1a)
(Note 1b)
(Note 1d)
(Note 1e)
(Note 1g)
(Note 1h)
(Note 1c)
(Note 1k)
(Note 1f)
(Note 1i)
(Note 1j)
(Note 1l)
θJC
AS
is guaranteed by design while R
= 39.2 A.
b. 81 °C/W when mounted on
a minimum pad of 2 oz copper
2.7
1.4
38
81
27
34
16
19
26
61
16
23
13
11
θCA
www.fairchildsemi.com
is determined by
°C/W

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