TLE8108EM Infineon Technologies, TLE8108EM Datasheet - Page 9

• Manufacturer Part Number: TLE8108EM
• Manufacturer: Infineon Technologies

Specifications of TLE8108EM

• Packages: PG-SSOP-24
• Thermal Class: Exposed Pad
• Id Nom: 8 x 0.5 A
• Pin Count: 24.0 Pins
• Channels: 8.0
• Comment: 8 channel realy and LED driver

4.2
Note: This thermal data was generated in accordance with JEDEC JESD51 standards.
Pos.
4.2.1
4.2.2
1) Not subject to production test, specified by design.
2) Homogenous power distrubution over all channels (all power stages equally heated), dependent on cooling setup.
3) Refer to
Figure 3
Data Sheet
For more information go to www.jedec.org.
Parameter
Junction to Case
Junction to Ambient (2s2p)
Figure 3
Thermal Resistance
PG-SSOP-24 PCB setup
for the setup.
Thermal Vias:
Metallization:
Dimensions:
Symbol
R
R
thJC
thJA
9
Min.
-
-
76.2 x 114.3 x 1.5 mm³ , FR4
JEDEC 2s2p (JESD 51-7) + (JESD 51-5)
F =0.3mm; plating 25µm; 10 pcs. for PG-SSOP-24
Limit Values
70µm modeled (traces)
35µm, 90% metallization
35µm, 90% metallization
70µm, 5% metallization
Typ.
-
40
Smart 8-Channel Low Side Switch
Max.
7
-
General Product Characteristics
Unit
K/W
K/W
Rev. 1.0, 2011-03-23
Conditions
P
P
TOT
TOT
TLE 8108 EM
Rth PCB setup.vsd
= 1W
= 1W
1) 2) 3)
1) 2) 3)