LE1030-PF Ligitek Group, LE1030-PF Datasheet - Page 5
LE1030-PF
Manufacturer Part Number
LE1030-PF
Description
Manufacturer
Ligitek Group
Datasheet
1.LE1030-PF.pdf
(6 pages)
Specifications of LE1030-PF
Chip Material
GaAsP/GaP
Chip Peak
635
Lens Color
Orange Diffused
Forward Voltage(vf) Min.
1.7
Forward Voltage(vf) Max.
2.6
Iv(mcd) Typ.
10
Viewing Angle 2?½
60
Pb
Yes
Mounting Style
Through Hole
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LE1030-PF
Manufacturer:
LIGITEK
Quantity:
40 000
PART NO. LE1030-PF
1.Iron:
Soldering Condition(Pb-Free)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
Ramp-Down:-5° C/sec(max)
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Solder Bath:260° C Max
2° C/sec(max)
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°
120°
25°
0°
0
60 Seconds Max
Preheat
max
2° /sec
50
LIGITEK ELECTRONICS CO.,LTD.
260° C3sec Max
Property of Ligitek Only
5° /sec
max
100
Time(sec)
150
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