STPCC4 STMicroelectronics, STPCC4 Datasheet - Page 86

• Manufacturer Part Number: STPCC4
• Description: STPC CONSUMER-II DATASHEET - X86 CORE PC COMPATIBLE INFORMATION APPLIANCE SYSTEM-ON-CHIP
• Manufacturer: STMicroelectronics

DESIGN GUIDELINES
As the PCB acts as a heat sink, the layout of top
and ground layers must be done with care to
maximize the board surface dissipating the heat.
The only limitation is the risk of losing routing
channels. Figure 6-31 and Figure 6-32 show a
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Figure 6-31. Layout for Good Thermal Dissipation - top layer
STPC ball
Via
Not Connected ball
Release 1.5 - January 29, 2002
routing with a good thermal dissipation thanks to
an optimized placement of power and signal vias.
The ground plane should be on bottom layer for
the best heat spreading (thicker layer than internal
ones) and dissipation (direct contact with air). .
GND ball
3.3V ball
2.5V ball (Core / PLLs)