NLU1G07AMX1TCG ON Semiconductor, NLU1G07AMX1TCG Datasheet - Page 6

• Manufacturer Part Number: NLU1G07AMX1TCG
• Description: IC BUFF OP/DRAIN NON-INV 6ULLGA
• Manufacturer: ON Semiconductor

Specifications of NLU1G07AMX1TCG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 6-ULLGA
• Number Of Channels Per Chip: 1
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Screw
• Input Bias Current (max): 1 uA
• Low Level Output Current: 8 mA
• Minimum Operating Temperature: - 55 C
• Output Type: Open Drain
• Propagation Delay Time: 10.6 ns @ 3 V to 3.6 V or 7.5 ns @ 4.5 V to 5.5 V
• Number Of Lines (input / Output): 1 / 1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

6X
REFERENCE
PIN ONE
0.05 C
0.05 C
0.10 C
0.10 C
L1
É É
É É É É
BOTTOM VIEW
SIDE VIEW
TOP VIEW
1
6
D
A1
4
3
e
6X
E
A
B
A
5X
b
C
0.10
0.05
L
SEATING
PLANE
NOTE 4
C
C
PACKAGE DIMENSIONS
NOTE 3
A
ULLGA6 1.0x1.0, 0.35P
B
http://onsemi.com
CASE 613AD-01
NLU1G07
ISSUE A
6
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.53
SOLDERMASK DEFINED*
MOUNTING FOOTPRINT
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
4. A MAXIMUM OF 0.05 PULL BACK OF THE
OUTLINE
PKG
ASME Y14.5M, 1994.
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
DIM
A1
L1
0.48
A
D
b
E
e
L
5X
1
MILLIMETERS
MIN
0.00
0.12
0.25
0.30
---
1.00 BSC
1.00 BSC
0.35 BSC
DIMENSIONS: MILLIMETERS
MAX
0.40
0.05
0.22
0.35
0.40
1.18
PITCH
0.35
0.22
6X