ADN2841 Analog Devices, Inc., ADN2841 Datasheet - Page 3

• Manufacturer Part Number: ADN2841
• Description: Dual-loop 50 Mbps.2.7 Gbps Laser Diode Driver
• Manufacturer: Analog Devices, Inc.

Parameter
IBMON, IMMON, IMPDMON, IMPDMON2
SUPPLY
NOTES
1
2
3
4
5
6
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
(T
V
Operating Temperature Range
Junction Temperature (T
48-Lead LFCSP Package
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADN2841 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
REV. A
Temperature range: –40°C to +85°C.
When the voltage on DATAP is greater than the voltage on DATAN, the modulation current flows in the IMODP pin.
Guaranteed by design and characterization. Not production tested.
IDTONE may cause eye distortion.
I
All V
CC
CC
A
IBMON, IMMON Division Ratio
IMPDMON, IMPDMON2
IMPDMON to IMPDMON2 Matching
Compliance Voltage
I
V
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . –65°C to +150°C
Power Dissipation . . . . . . . . . . . . . . .(T
θ
Lead Temperature (Soldering for 10 sec) . . . . . . . . 300°C
CC
= 25°C, unless otherwise noted.)
for power calculation is the typical I
JA
CC
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
CCS
5
Thermal Impedance
6
should be shorted together.
DATAP/DATAN
CLKP
Figure 1. Setup and Hold Time
J MAX
2
Model
ADN2841ACP-32
ADN2841ACP-48
ADN2841ACP-32-RL
ADN2841ACP-32-RL7
ADN2841ACP-48-RL
. . . . . . . . . . . . . . . . . . . . 25°C/W
SETUP
) . . . . . . . . . . . . . . . . . . 150°C
t
S
CC
given.
1
HOLD
t
J MAX
H
– T
A
)/θ
ORDERING GUIDE
JA
Temperature Range Package Description
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Min
0
4.5
mW
–3–
Typ
100
1
0.05
5.0
32-Lead LFCSP Package
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause perma-
θ
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Transient currents of
up to 100 mA will not cause SCR latch-up.
JA
θ
Lead Temperature (Soldering for 10 sec) . . . . . . . . . 300°C
Power Dissipation . . . . . . . . . . . . . . . (T
JA
is defined when the part is soldered onto a four-layer board.
Thermal Impedance
Max
1
V
5.5
CC
– 1.2
32-Lead LFCSP
48-Lead LFCSP
32-Lead LFCSP
32-Lead LFCSP
48-Lead LFCSP
Unit
A/A
A/A
%
V
A
V
2
. . . . . . . . . . . . . . . . . . . . 32°C/W
WARNING!
Conditions/Comments
IMPD = 1200 µA
I
BIAS
= I
MOD
J MAX
ESD SENSITIVE DEVICE
= 0
– T
ADN2841
A
)/θ
JA
mW