UPD78F4046GC-3B9 NEC, UPD78F4046GC-3B9 Datasheet - Page 33

• Manufacturer Part Number: UPD78F4046GC-3B9
• Description: 16-BIT SINGLE-CHIP MICROCONTROLLER
• Manufacturer: NEC

10. RECOMMENDED SOLDERING CONDITIONS
Mounting Technology Manual (C10535E).
representative.
PD78F4046GC-3B9: 80-pin plastic QFP (14
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Method
The PD78F4046 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
For soldering methods and conditions other than those recommended below, contact your NEC
Note
Caution
After opening the dry pack, store it at 25 C or less and 65% RH or less for the allowable storage period.
Do not use different soldering methods together (except for partial heating).
Package peak temperature: 235 C, Time: 30 seconds max. (at 210 C or
higher), Count: Twice or less, Exposure limit: 7 days
prebake at 125 C for 20 hours)
Package peak temperature: 215 C, Time: 40 seconds max. (at 200 C or
higher), Count: Twice or less, Exposure limit: 7 days
prebake at 125 C for 20 hours)
Solder bath temperature: 260 C max., Time: 10 seconds max., Count:
Once, Preheating temperature: 120 C max. (package surface
temperature), Exposure limit: 7 days
for 20 hours)
Pin temperature: 300 C max., Time: 3 seconds max. (per pin row)
Table 10-1. Surface Mounting Type Soldering Conditions
Data Sheet U11447EJ2V0DS00
Soldering Conditions
14 mm)
Note
(after 7 days, prebake at 125 C
Note
Note
(after 7 days,
(after 7 days,
IR35-207-2
VP15-207-2
WS60-207-1
PD78F4046
Recommended
Condition Symbol
–
33