upd72862 Renesas Electronics Corporation., upd72862 Datasheet - Page 32

• Manufacturer Part Number: upd72862
• Description: Ieee1394 Ohci Host Controller
• Manufacturer: Renesas Electronics Corporation.

7. RECOMMENDED SOLDERING CONDITIONS
Technology Manual (C10535E).
representative.
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
32
Infrared reflow
VPS
Partial heating
PD72862GC-9EU : 100-pin plastic TQFP (Fine pitch) (14 x 14)
The PD72850A should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
For soldering methods and conditions other than those recommended below, contact your NEC sales
Soldering
Method
Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher).
Count: three times or less
Exposure limit: 3 days
Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher).
Count: three times or less
Exposure limit: 3 days
Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)
Table 7-1. Surface Mounting Type Soldering Conditions
Note
Note
(after that prebake at 125°C for 10 hours)
(after that prebake at 125°C for 10 hours)
Data Sheet S14265EJ2V0DS00
Soldering Conditions
Condition Symbol
Recommended
PD72862
VP15-103-3
IR35-103-3
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