vnd830p-e STMicroelectronics, vnd830p-e Datasheet - Page 20
vnd830p-e
Manufacturer Part Number
vnd830p-e
Description
Double Channel High-side Driver
Manufacturer
STMicroelectronics
Datasheet
1.VND830P-E.pdf
(27 pages)
- Current page: 20 of 27
- Download datasheet (422Kb)
VND830P-E
4
4.1
Package and PCB thermal data
SO-16L thermal data
Figure 26. SO-16L PC board
Figure 27. R
Note:
Layout condition of R
35 µm, Copper areas: 0.5 cm
70
65
60
55
50
45
40
0
RTH j-amb (°C/W)
thj-amb
th
and Z
1
vs PCB copper area in open box free air condition
th
2
, 6 cm
measurements (PCB FR4 area = 41 mm x 48 mm, PCB thickness = 2 mm, Cu thickness =
2
).
Doc ID 17546 Rev 2
2
(1)
PCB Cu heatsink area (cm^2)
3
4
Package and PCB thermal data
5
6
7
20/27
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