tda8595th-n2 NXP Semiconductors, tda8595th-n2 Datasheet - Page 47
tda8595th-n2
Manufacturer Part Number
tda8595th-n2
Description
Tda8595 I?c-bus Controlled 4 X 45 W Power Amplifier
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8595TH-N2.pdf
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16. Mounting
17. Abbreviations
TDA8595_2
Product data sheet
Table 18.
Acronym
BCDMOS
BTL
CMOS
DMOS
DSP
EMC
ESR
NMOS
PMOS
POR
SOAR
SOI
Fig 41. SOT878-1 reflow soldering footprint
Dimensions in mm.
Reflow soldering is the recommended soldering method.
Dimension ‘1’ relates to dimension ‘e
Figure
Abbreviations
40.
hole diameter min. 0.92
27
26
Description
Bipolar CMOS/DMOS
Bridge Tied Load
Complementary Metal-Oxide Semiconductor
Diffusion Metal Oxide Semiconductor
Digital Signal Processor
ElectroMagnetic Compatibility
Equivalent Series Resistance
Negative Metal Oxide Semiconductor
Positive Metal Oxide Semiconductor
Power-On Reset
Safe Operating ARea
Silicon On Insulator
2
Rev. 02 — 21 November 2007
1
’ in
Figure
0.08
I
2
C-bus controlled 4
M
40; dimension ‘2’ relates to dimension ‘e
Dimensions in mm
1
2
sot878-1_fr
45 W power amplifier
1
TDA8595
2.54
© NXP B.V. 2007. All rights reserved.
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