tda9899 NXP Semiconductors, tda9899 Datasheet - Page 98

• Manufacturer Part Number: tda9899
• Description: Tda9899 Multistandard Hybrid If Processing Including Car Mobile
• Manufacturer: NXP Semiconductors

NXP Semiconductors
TDA9899_3
Product data sheet
16.3.2 Wave soldering
Table 60.
Table 61.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 52. Temperature profiles for large and small components
2.5
MSL: Moisture Sensitivity Level
temperature
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
Figure
52.
Rev. 03 — 15 January 2008
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
Multistandard hybrid IF processing including car mobile
minimum peak temperature
= MSL limit, damage level
3
3
)
)
350 to 2000
260
250
245
220
220
350
temperature
peak
> 2000
260
245
245
TDA9899
© NXP B.V. 2008. All rights reserved.
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