adg633 Analog Devices, Inc., adg633 Datasheet - Page 5

• Manufacturer Part Number: adg633
• Description: Cmos +v/+5 V/+3 V Triple Spdt Switch
• Manufacturer: Analog Devices, Inc.

ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Analog Inputs
Digital Inputs
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . . . –65°C to +150°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily ac cu mu late
on the human body and test equipment and can discharge without detection. Although the ADG633
features proprietary ESD pro tec tion circuitry, permanent damage may occur on devices subjected to high
energy electrostatic discharges. Therefore, proper ESD pre cau tions are rec om mend ed to avoid per for mance
deg ra da tion or loss of functionality.
Model
ADG633YRU
ADG633YCP
A2
X
0
0
0
0
1
1
1
1
X = Don’t Care
REV. 0
DD
DD
SS
A
Automotive (Y Version) . . . . . . . . . . . . . . . –40°C to +125°C
Industrial (B Version) . . . . . . . . . . . . . . . . . . –40°C to +85°C
= 25°C, unless otherwise noted.)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V
to V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +13 V
SS
A1
X
0
0
1
1
0
0
1
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
2
2
. . . . . . . . . . . . . . . . . .V
. . . . . . . . . . . . . . . . GND – 0.3 V to V
A0
X
0
1
0
1
0
1
0
1
Table I. ADG633 Truth Table
Temperature Range
–40°C to +125°C
–40°C to +85°C
(Pulsed at 1 ms, 10% duty cycle max)
1
0
0
0
0
0
0
0
0
or 10 mA, whichever occurs fi rst
1
Switch Condition
NONE
D1–S1A, D2–S2A, D3–S3A
D1–S1B, D2–S2A, D3–S3A
D1–S1A, D2–S2B, D3–S3A
D1–S1B, D2–S2B, D3–S3A
D1–S1A, D2–S2A, D3–S3B
D1–S1B, D2–S2A, D3–S3B
D1–S1A, D2–S2B, D3–S3B
D1–S1B, D2–S2B, D3–S3B
SS
– 0.3 V to V
DD
DD
Package Description
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (LFCSP)
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
–5–
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead Temperature, Soldering
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 kV
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause permanent
damage to the device. This is a stress rating only; functional operation of the device
at these or any other conditions above those listed in the operational sections of this
specifi cation is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Only one absolute maximum rating
may be applied at any one time.
Overvoltages at A
be limited to the maximum ratings given.
JA
JA
16-Lead LFCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Thermal Impedance, 16-Lead TSSOP . . . . . . . . 150.4°C/W
Thermal Impedance (4-Layer Board),
X
,
, S, or D will be clamped by internal diodes. Current should
PIN CONFIGURATIONS
S3B
S3A
D3
GND
S2A
S3B
S3A
S2B
V
D3
SS
2
3
1
4
1
2
3
4
5
6
7
8
16
(Not to Scale)
5
(Not to Scale)
TSSOP
ADG633
TOP VIEW
LFCSP
TOP VIEW
ADG633
15
6
14
7
13
8
16
15
14
13
12
11
10
9
12
11
10
9
V
D2
D1
S1B
S1A
A0
A1
A2
D1
S1B
S1A
A0
DD
Package Option
RU-16
CP-16
ADG633