tda3683 NXP Semiconductors, tda3683 Datasheet - Page 28
tda3683
Manufacturer Part Number
tda3683
Description
Tda3683 Multiple Voltage Regulator With Switch And Ignition Buffer
Manufacturer
NXP Semiconductors
Datasheet
1.TDA3683.pdf
(31 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
tda3683J
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
tda3683J/N2S
Manufacturer:
NXP/恩智浦
Quantity:
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Philips Semiconductors
13. Soldering
TDA3683_2
Product data sheet
13.1 Introduction to soldering through-hole mount packages
13.2 Soldering by dipping or by solder wave
13.3 Manual soldering
13.4 Package related soldering information
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Table 9:
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Rev. 02 — 7 October 2005
Multiple voltage regulator with switch and ignition buffer
Soldering method
Dipping
-
suitable
-
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Wave
suitable
suitable
not suitable
stg(max)
TDA3683
[1]
). If the
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