uaa1570hl NXP Semiconductors, uaa1570hl Datasheet - Page 57
uaa1570hl
Manufacturer Part Number
uaa1570hl
Description
Global Positioning System Gps Front-end Receiver Circuit
Manufacturer
NXP Semiconductors
Datasheet
1.UAA1570HL.pdf
(76 pages)
- Current page: 57 of 76
- Download datasheet (722Kb)
Philips Semiconductors
1999 May 10
handbook, full pagewidth
Global Positioning System (GPS) front-end
receiver circuit
UAA1570HL
45
48
14
17
18
21
22
24
25
44
46
47
42
38
26
20
13
15
11
35
3
6
5
4
2
LNA1IN
LNA1OUT
LNA2IN
LNA2OUT
MX1IN
IF1P
IF1N
IF2INN
IF2INP
IF2P
IF2N
LNA1GND1
BIASGND1
LNA1GND2
LNA2GND2
BIASGND2
LNA2GND1
P42GND
PLLGND
LIMGND
MX2GND
MXPGND
MX1GND
VCOGND
DGND
DGND AGND
Fig.30 RF front-end circuit (continued from Fig.29).
VRF
R303
9
M1BIASP
M1BIASN
M2BIASP
M2BIASN
L = 315 mils (8.1 mm)
W = 6 mils
100
AGND
R307
L = 412 mils (10.5 mm)
9
AGND
L = 355 mils (9 mm)
C320
1.2 pF
57
W = 6 mils
AGND
C321
0.27 pF
W = 6 mils
100
C313
36 pF
C301
82 pF
100
(50 V)
33 nF
C328
AGND
W = 8.8 mils
6.8 pF
6.8 pF
L = 900 mils
C315
C316
C302
47 pF
C304
open
AGND
C324
1.5 pF
AGND
C306
0.47 pF
C307
open
C325
27 pF
L303
330 nH
C309
18 pF
L = 217 mils (5.5 mm)
L = 386 mils (10 mm)
W = 6 mils 100
AGND
L = 286 mils (7.3 mm)
W = 6 mils 100
W = 33 mils
L = 367 mils (9.3 mm)
10 pF
(50 V)
C327
50
L301
22 H
W = 33 mils
C314
36 pF
L = 1020 mils
W = 8.8 mils
50
8.2 pF
8.2 pF
47 pF
C317
C318
C303
R301
0
I/O
I/O
2
L304
330 nH
AGND
L302
22 H
2
AGND
MF1012S-1
1
BPF302
AGND
MF1012S-1
1
3
C305
open
BPF301
C326
0.56 pF
AGND
3
4 6
C319
39 pF
C310
68 pF
4 6
5
UAA1570HL
5
Product specification
I/O
AGND
SMA-F
AGND
J301
R306
909
R305
820
I/O
R302
0
AGND
1000 pF
1000 pF
AGND
C311
C312
C322
2.2 pF
C323
2.2 pF
MHB293
LIMINP
LIMINN
Related parts for uaa1570hl
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: