tga8652-epu-sl TriQuint Semiconductor, tga8652-epu-sl Datasheet - Page 14

• Manufacturer Part Number: tga8652-epu-sl
• Description: Oc192 Modulator Driver, Smt Package
• Manufacturer: TriQuint Semiconductor

Assembly of a TGA8652-EPU Surface Mount Package onto a Motherboard
Manual Assembly for Prototypes
1. Clean the motherboard with Acetone and rinse with alcohol and DI water. Allow the motherboard to fully dry.
2. Using a standard SN63 solder paste, such as Kester SN63 R-560, dispense solder paste dots of 5 to 15 mil in diameter to the
motherboard as shown in the example motherboard in Figure 1 below. Assure that there is a minimum of 5 mils and a maximum of 10 mils
between the edge of each solder paste area and the closest edge of the ground pad.
3. Manually place a TGA8652-EPU on the motherboard with correct orientation and good alignment. The alignment can be determined
manually by centering the package on the motherboard. The RF traces (pin 6 and pin 12) are located along the center horizontal axis of
the package. DC traces pin 3 and pin 9 are located along the center vertical axis of the package. (Fig. 2)
4. Reflow the assembly on a hot plate with the surface temperature of the plate near 230
5. Let the assembly completely cool down. This package has little or no tendency to self- align during the reflow.
6. Clean the assembly with acetone and rinse with alcohol and DI water.
CAUTION: The TGA8652-EPU contains GaAs MMIC devices are susceptible to damage from Electrostatic
Discharge. Proper precautions should be observed during handling, assembly and test.
TriQuint Semiconductor Texas: [phone] Fax [phone] Email: [e-mail] Web: www.triquint.com
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
High Volume Assembly of the Package
The TGA8652-EPU is a standard surface mount component compatible with standard high volume assembly processes using
standard SN63 solder paste, such as Kester R560. Refer to Kester R560 manufacture data sheet for recommended reflow
profile, cleaning, and handling. Dispense solder paste using standard solder printing techniques such as stencil solder
printing. Pick-and-place using a standard machine such as MRSI machine. Perform solder reflow using a Sikama Reflow
System. Recommended solder stencil and motherboard interface layout are available upon request.
dispensing areas
Solder paste
(19 plcs)
Pin 1
Figure 1: Solder paste dispensing
pattern used on the evaluation
board motherboard.
Figure 2: Bottom View
o
C for 5 to 6 seconds.
[TGA8652-EPU]
Product Data Sheet
June 14, 2005
Pin 1
Pin 12
RF(in)
14