smcj170ca-. Vishay, smcj170ca-. Datasheet - Page 3

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smcj170ca-.

Manufacturer Part Number
smcj170ca-.
Description
Surface Mount Transzorb ?ransient Voltage Suppressor Neral Semiconductor
Manufacturer
Vishay
Datasheet
ELECTRICAL CHARACTERISTICS at (T
N0TES:
(1) V
(2) Surge current waveform per Fig. 3 and derate per Fig. 2
(3) For bi-directional types having V
(4) For the bi-directional SMCG/SMCJ5.0CA, the maximum V
(5) All terms and symbols are consistent with ANSI/IEEE C62.35
These surface mountable packages are designed specifically for transient voltage suppression. The wide leads assure a large sur-
face contact for good heat dissipation, and a low resistance path for surge current flow to ground. These high speed transient voltage
suppressors can be used to effectively protect sensitive components such as integrated circuits and MOS devices.
A 1500W (SMC) device is normally selected when the threat of transients is from lightning-induced transients conducted via external
leads or I/0 lines. It is also used to protect against switching transients induced by large coils or industrial motors.
System impedance at component level in a system is usually high enough to limit the current to within the peak pulse current (I
rating of this series.
(BR)
Device Type
SMCG54
SMCG54A
SMCG58
SMCG58A
SMCG60
SMCG60A
SMCG64
SMCG64A
SMCG70
SMCG70A
SMCG75
SMCG75A
SMCG78
SMCG78A
SMCG85
SMCG85A
SMCG90
SMCG90A
SMCG100
SMCG100A
SMCG110
SMCG110A
SMCG120
SMCG120A
SMCG130
SMCG130A
SMCG150
SMCG150A
SMCG160
SMCG160A
SMCG170
SMCG170A
Gull Wing
measured after I
Lead
0.125" (3.17)
“J” Bend Lead
Device Type
T
0.050" (1.27)
The pad dimensions should be 0.010” (0.25mm) longer than the contact size, in the lead axis.
Modified
applied for 300 s square wave pulse or equivalent
SMCJ54
SMCJ54A
SMCJ58
SMCJ58A
SMCJ60
SMCJ60A
SMCJ64
SMCJ64A
SMCJ70
SMCJ70A
SMCJ75
SMCJ75A
SMCJ78
SMCJ78A
SMCJ85
SMCJ85A
SMCJ90
SMCJ90A
SMCJ100
SMCJ100A
SMCJ110
SMCJ110A
SMCJ120
SMCJ120A
SMCJ130
SMCJ130A
SMCJ150
SMCJ150A
SMCJ160
SMCJ160A
SMCJ170
SMCJ170A
This allows a solder fillet to form, see figure below. Contact factory for soldering methods.
WM
of 10 Volts and less, the I
GULL- WING
0.310" (7.87)
GGW
GGG
GGM
GGQ
GHM
GGF
GGH
GGK
GGN
GGP
GGR
GGS
GGT
GGU
GGV
GGX
GGY
GGZ
GHD
GHE
GHG
GHH
GHK
GHN
GHP
GHQ
GHR
GGL
GHF
GHL
GGD
GGE
UNI
Marking
Device
Code
GGD
GGE
GGF
GGG
GGH
GGK
GGL
GGM
GGN
GGP
GGQ
GGR
GGS
GGT
GGU
GGV
GGW
GGX
GGY
GGZ
GHD
GHE
GHF
GHG
GHH
GHK
GHL
GHM
GHN
GHP
GHQ
GHR
BI
A
(BR)
=
25°C unless otherwise noted) TABLE 1 (Cont’d)
RECOMMENDED PAD SIZES
(MIN / MAX)
Breakdown
V
D
6.4.4 / 71.2
60.0 / 73.3
60.0 / 66.3
64.4 / 78.7
66.7 / 81.5
66.7 / 73.7
71.1 / 86.9
71.1 / 78.6
77.8 / 95.1
77.8 / 86.0
83.3 / 92.1
86.7 / 95.8
is 7.25 Volts
83.3 / 102
86.7 / 106
94.4 / 115
94.4 / 104
16.7 / 204
100 / 122
100 / 111
111 / 136
111 / 123
122 / 149
122 / 135
133 / 163
133 / 147
144 / 176
144 / 159
167 / 185
178 / 218
178 / 197
189 / 231
189 / 209
(BR)
limit is doubled
Voltage
(NOTE 1)
APPLICATION N0TES
(Volts)
at I
Current
Test
T
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
(mA)
V
Stand-off
WM
Voltage
54.0
54.0
100
100
110
110
120
120
130
130
150
150
160
160
170
170
58
58
60
60
64
64
70
70
75
75
78
78
85
85
90
90
(Volts)
(NOTE 3)
Maximum
Reverse
Leakage
at V
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
WM
MODIFIED J-BEND
I
D
0.125" (3.17)
( A)
0.070" (1.78)
0.190" (4.83)
(NOTE 2)
Current I
Peak Pulse
Maximum
Surge
15.6
17.2
14.6
16.0
14.0
15.5
13.2
14.6
12.0
13.3
11.2
12.4
10.8
11.9
10.9
10.3
9.9
9.4
8.4
9.3
7.7
8.5
7.0
7.8
6.5
7.2
5.6
6.2
5.2
5.8
4.9
5.5
(Amps)
PPM
Voltage at I
Maximum
Clamping
V
C
96.3
87.1
103
107
114
103
125
113
134
121
139
126
151
137
160
146
179
162
196
177
214
193
231
209
268
243
287
259
304
275
(Volts)
93
96
PP
PPM
)

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