AD5522JSVD AD [Analog Devices], AD5522JSVD Datasheet - Page 12

• Manufacturer Part Number: AD5522JSVD
• Description: Quad Parametric Measurement Unit With Integrated 16-Bit Level Setting DACs
• Manufacturer: AD [Analog Devices]

AD5522
ABSOLUTE MAXIMUM RATINGS
Table 3. AD5522 Absolute Maximum Ratings
Parameter
Supply Voltage AV
AV
AV
V
DUTGND to AGND
REFGND to AGND
DV
AGND to DGND
Digital Inputs to DGND
Analog Inputs to AGND
Storage Temperature
Operating Junction Temperature
Reflow Soldering
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other condition s above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
REF
Peak Temperature
Time at Peak Temperature
DD
SS
CC
to AGND
to AGND
to AGND
to DGND
DD
to AV
SS
Rating
34V
-0.3V to 34V
0.3V to -34V
-0.3 V, +7V
AV
AV
- 0.3V to 7V
- 0.3V to +0.3V
- 0.3V to DV
AV
–65°C to +125°C
+25 to +90°C
230°C
10s to 40s
150°C max
DD
DD
SS
- 0.3V to AV
+0.3V to AV
+0.3V to AV
CC
+0.3V
DD
SS
SS
+0.3V
-0.3V
-0.3V
Rev. PrM | Page 12 of 48
THERMAL RESISTANCE
Thermal resistance values are specified for the worst-case
conditions, i.e., specified for device soldered in circuit board for
surface mount packages.
Table 4. Thermal Resistance (JEDEC 4 layer (1S2P) board)
Air Flow (LFPM)
TQFP Exposed Pad Down
TQFP Exposed Pad Up
Table 5. Thermal Resistance (JEDEC 4 layer (1S2P) board
with cooling plate
ambient)
Package Thermals
TQFP Exposed Pad Down
TQFP Exposed Pad Up
3
4
Simulated Thermal information.
Assumes perfect thermal contact between cooling plate and exposed
paddle
4
Preliminary Technical Data
at 45°C, natural convection at 55°C
3
θ
θ
θ
θ
JA
JC
JA
JC
0
22.3
4.8
TBD
2
θ
5.4
3.0
JA
200
17.2
TBD
θ
4.8
2
JC
500
15.1
TBD
Unit
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W