MAX5318 MAXIM [Maxim Integrated Products], MAX5318 Datasheet - Page 2

• Manufacturer Part Number: MAX5318
• Description: 18-Bit, High-Accuracy Voltage Output DAC with Digital Gain, Offset Control, and SPI Interface
• Manufacturer: MAXIM [Maxim Integrated Products]

ABSOLUTE MAXIMUM RATINGS
AGND to DGND ...................................................-0.3V to +0.3V
AGND_F, AGND_S to AGND ...............................-0.3V to +0.3V
AGND_F, AGND_S to DGND ...............................-0.3V to +0.3V
AVDD to AGND .......................................................-0.3V to +6V
AVDD to REF ...........................................................-0.3V to +6V
AVSS to AGND ........................................................-2V to +0.3V
V
BYPASS to DGND ....................................... -0.3V to the lower of
OUT, REFO, RFB to AGND ......................... -0.3V to the lower of
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
ELECTRICAL CHARACTERISTICS
(V
PD = LDAC = M/Z = DGND, RST = V
otherwise noted. Typical values are at T
Maxim Integrated
STATIC PERFORMANCE
Resolution
Integral Nonlinearity (Note 3)
Differential Nonlinearity (Note 3)
Zero Code Error
Zero Code Error Drift (Note 4)
Gain Error
Gain Error Temperature
Coefficient (Note 4)
Output Voltage Range
DDIO
AVDD
Junction-to-Case Thermal Resistance (q
Junction-to-Ambient Thermal Resistance (q
to DGND .......................................................-0.3V to +6V
= V
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
18-Bit, High-Accuracy Voltage Output DAC with
PARAMETER
DDIO
Digital Gain, Offset Control, and SPI Interface
= 4.5V to 5.5V, V
(V
AVDD_
or V
DDIO
SYMBOL
AVSS
(V
TCGE
DDIO
DNL
A
INL
OE
GE
AVDD
N
= +25°C.) (GAIN = 0x3FFFF and OFFSET = 0x00000.)(Note 2)
, C
JA
= -1.25V, V
) ...............13°C/W
+ 0.3V) and +4.5V
REFO
JA
+ 0.3V) and +6V
) ..........72°C/W
DIN = 0x00000 to 0x3FFFF
(binary mode), DIN = 0x20000 to 0x1FFFF
(two’s complement mode)
DIN = 0x01900 to 0x3FFFF (binary
mode), DIN = 0x21900 to 0x1FFFF (two’s
complement mode), V
DIN = 0, T
DIN = 0, T
DIN = 0
T
T
No load
A
A
= 100pF, C
= +25NC
= -40NC to +105NC
AGND
A
A
= +25NC
= -40NC to +105NC
L
= V
CONDITIONS
= 100pF, R
DGND
REF to AGND ...................-0.3V to the lower of V
SCLK, DIN, CS, BUSY, LDAC, READY,
M/Z, TC/SB, RST, PD, DOUT to DGND ....... -0.3V to the lower of
Continuous Power Dissipation (T
Operating Temperature Range ........................ -40NC to +105NC
Maximum Junction Temperature .....................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TSSOP (derate 13.9mW/NC above +70NC).............1111.1mW
AVSS
= V
L
= 10kω, C
= 0V
AGND_F
= V
BYPASS
AGND_S
= 1µF, T
MIN
-1.6
-2.5
-48
-16
18
-2
-1
0
= 0V, V
A
= +70NC)
Q0.275
A
Q0.10
Q0.10
Q0.5
TYP
Q14
Q27
= -40°C to +105°C, unless
Q4
Q1
REF
MAX5318
(V
DDIO
= 4.096V, TC/SB =
V
AVDD
MAX
+1.6
+2.5
+48
+16
0.1
+2
+1
+ 0.3V) and +6V
AVDD
-
and +6V
ppm/NC
ppm/NC
UNITS
of FSR
LSB
LSB
LSB
LSB
Bits
V
2