MC68HC908JK3EMP MOTOROLA [Motorola, Inc], MC68HC908JK3EMP Datasheet - Page 213
MC68HC908JK3EMP
Manufacturer Part Number
MC68HC908JK3EMP
Description
Microcontrollers
Manufacturer
MOTOROLA [Motorola, Inc]
Datasheet
1.MC68HC908JK3EMP.pdf
(226 pages)
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19.5 28-Pin PDIP
19.6 28-Pin SOIC
MC68H(R)C908JL3E/JK3E/JK1E
MOTOROLA
28
1
H
28
1
28X
G
26X
0.010 (0.25)
D
G
-A-
F
A
M
T
A
Figure 19-4. 28-Pin SOIC (Case #751F)
Figure 19-3. 28-Pin PDIP (Case #710)
—
S
D
14
15
Rev. 2.0
B
SEATING
PLANE
S
N
B
14
15
K
K
-B-
Mechanical Specifications
C
C
SEATING
PLANE
-T-
R
14X
X 45
P
0.010 (0.25)
M
L
J
M
B
M
M
J
NOTES:
F
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
2. DIMENSION L TO CENTER OF LEADS WHEN
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
FORMED PARALLEL.
DIM
A
B
C
D
G
H
K
M
N
F
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
36.45
13.72
MILLIMETERS
MIN
3.94
0.36
1.02
1.65
0.20
2.92
0.51
DIM
15.24 BSC
M
2.54 BSC
A
B
C
D
F
G
K
P
R
0°
J
17.80
10.01
MILLIMETERS
Mechanical Specifications
37.21
14.22
MIN
MAX
7.40
2.35
0.35
0.41
0.23
0.13
0.25
5.08
0.56
1.52
2.16
0.38
3.43
1.02
0°
15°
1.27 BSC
18.05
10.55
MAX
1.435
0.540
0.155
0.014
0.040
0.065
0.008
0.020
0.115
7.60
2.65
0.49
0.90
0.32
0.29
0.75
MIN
8°
0.600 BSC
0°
0.100 BSC
INCHES
0.701
0.292
0.093
0.014
0.016
0.009
0.005
0.395
0.010
1.465
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
MAX
MIN
15°
0.050 BSC
0°
INCHES
Technical Data
28-Pin PDIP
0.299
0.104
0.019
0.035
0.013
0.415
0.029
MAX
0.711
0.011
8°
213
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