MC35XS3400 FREESCALE [Freescale Semiconductor, Inc], MC35XS3400 Datasheet - Page 42

• Manufacturer Part Number: MC35XS3400
• Description: Quad High Side Switch (Quad 35m?)
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Device on Thermal Test Board
42
35XS3400
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
Material:
Outline:
Area A:
Ambient Conditions:
Figure 18. Steady State Thermal Resistance in Dependence on Heat Spreading Area;
65.00
60.00
55.00
50.00
45.00
40.00
35.00
30.00
25.00
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07mm thickness
Cu buried traces thickness 0.035mm
76.2mm x 114.3mm board area,
including edge connector for thermal
testing, 74mm x 74mm buried layers
area
Cu heat-spreading areas on board
surface
Natural convection, still air
0
1s JEDEC Thermal Test Board with Spreading Areas
100
RJA11
Heat spreading area [sqmm]
200
RJA12=RJA21
Table 25. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
300
Resistance
R
Thermal
R
This device is a dual die package. Index m indicates the
θ
JA mn
θJA
is the thermal resistance between die junction and
400
Area A
(mm
150
300
450
600
0
2
RJA22
)
Analog Integrated Circuit Device Data
1 = Power Chip, 2 = Logic Chip
m = 1,
47.63
42.82
41.23
40.07
39.24
500
n = 1
Freescale Semiconductor
m = 1, n = 2
m = 2, n = 1
600
37.21
33.14
31.84
30.90
30.14
m = 2,
53.61
51.06
50.36
49.26
48.57
n = 2
(°C/W)