S912XEG128J2MAL Freescale Semiconductor, S912XEG128J2MAL Datasheet - Page 243
S912XEG128J2MAL
Manufacturer Part Number
S912XEG128J2MAL
Description
16-bit Microcontrollers - MCU 16BIT 128K FLASH 16K RAM
Manufacturer
Freescale Semiconductor
Datasheet
1.S912XEG128J2MAL.pdf
(1324 pages)
Specifications of S912XEG128J2MAL
Rohs
yes
Core
RISC
Processor Series
HCS12X
Data Bus Width
16 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
128 KB
Data Ram Size
12 KB
On-chip Adc
Yes
Operating Supply Voltage
5 V
Operating Temperature Range
- 40 C to + 125 C
Package / Case
LQFP-112
Mounting Style
SMD/SMT
A/d Bit Size
12 bit
A/d Channels Available
8
Data Rom Size
4 KB
Interface Type
CAN, I2C, SCI, SPI
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
On-chip Dac
Yes
Program Memory Type
Flash
Supply Voltage - Max
5.5 V
Supply Voltage - Min
3.13 V
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
S912XEG128J2MAL
Manufacturer:
NXP/恩智浦
Quantity:
20 000
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Refer to the S12X_MMC section for a detailed description of the MCU operating modes.
5.1.4
Figure 5-1
5.2
The user is advised to refer to the SoC section for port configuration and location of external bus signals.
Table 5-2
and PIM section for reset states of these pins and associated pull-ups or pull-downs.
Freescale Semiconductor
External Signal Description
outlines the pin names and gives a brief description of their function. Refer to the SoC section
is a block diagram of the XEBI with all related I/O signals.
Block Diagram
The following external bus related signals are described in other sections:
ECLK, ECLKX2 (free-running clocks) — PIM section
TAGHI, TAGLO (tag inputs) — PIM section, S12X_DBG section
EWAIT
MC9S12XE-Family Reference Manual Rev. 1.25
Figure 5-1. XEBI Block Diagram
XEBI
NOTE
Chapter 5 External Bus Interface (S12XEBIV4)
ADDR[22:0]
DATA[15:0]
IVD[15:0]
LSTRB
RW
UDS
LDS
RE
WE
ACC[2:0]
IQSTAT[3:0]
CS[3:0]
243
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