LPC1113FHN33/303,5 NXP Semiconductors, LPC1113FHN33/303,5 Datasheet - Page 52
LPC1113FHN33/303,5
Manufacturer Part Number
LPC1113FHN33/303,5
Description
ARM Microcontrollers - MCU Cortex-M0 24 kB flash up to 8kB SRAM
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1113FHN333035.pdf
(538 pages)
Specifications of LPC1113FHN33/303,5
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1113
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
24 KB
Data Ram Size
4 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 65 C to + 150 C
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Factory Pack Quantity
260
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NXP Semiconductors
UM10398
User manual
Table 47.
Bit
1:0
31:2 -
Symbol
FLASHTIM
Flash configuration register (FLASHCFG, address 0x4003 C010) bit description
All information provided in this document is subject to legal disclaimers.
Valu
e
00
01
10
11
-
Rev. 12 — 24 September 2012
Chapter 3: LPC111x/LPC11Cxx System configuration (SYSCON)
Description
Flash memory access time. FLASHTIM +1 is equal to the
number of system clocks used for flash access.
1 system clock flash access time (for system clock
frequencies of up to 20 MHz).
2 system clocks flash access time (for system clock
frequencies of up to 40 MHz).
3 system clocks flash access time (for system clock
frequencies of up to 50 MHz).
Reserved.
Reserved. User software must not change the value of
these bits. Bits 31:2 must be written back exactly as read.
UM10398
© NXP B.V. 2012. All rights reserved.
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Reset
value
10
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