LPC1113FHN33/303,5 NXP Semiconductors, LPC1113FHN33/303,5 Datasheet - Page 54
LPC1113FHN33/303,5
Manufacturer Part Number
LPC1113FHN33/303,5
Description
ARM Microcontrollers - MCU Cortex-M0 24 kB flash up to 8kB SRAM
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1113FHN333035.pdf
(538 pages)
Specifications of LPC1113FHN33/303,5
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1113
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
24 KB
Data Ram Size
4 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 65 C to + 150 C
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Factory Pack Quantity
260
- Current page: 54 of 538
- Download datasheet (5Mb)
NXP Semiconductors
UM10398
User manual
4.3.2 General purpose registers 0 to 3
4.3.3 General purpose register 4
Table 49.
The general purpose registers retain data through the Deep power-down mode when
power is still applied to the V
Only a “cold” boot when all power has been completely removed from the chip will reset
the general purpose registers.
Table 50.
The general purpose register 4 retains data through the Deep power-down mode when
power is still applied to the V
Only a “cold” boot, when all power has been completely removed from the chip, will reset
the general purpose registers.
Remark: If there is a possibility that the external voltage applied on pin V
2.2 V during Deep power-down, the hysteresis of the WAKEUP input pin has to be
disabled in this register before entering Deep power-down mode in order for the chip to
wake up.
Table 51.
Bit
8
10:9
11
31:12
Bit
31:0
Bit
9:0
Symbol
SLEEPFLAG
-
DPDFLAG
-
Symbol
-
Symbol
GPDATA
Power control register (PCON, address 0x4003 8000) bit description
General purpose registers 0 to 3 (GPREG0 - GPREG3, address 0x4003 8004 to
0x4003 8010) bit description
General purpose register 4 (GPREG4, address 0x4003 8014) bit description
All information provided in this document is subject to legal disclaimers.
Rev. 12 — 24 September 2012
Value
0
1
-
0
1
-
Value
-
Chapter 4: LPC111x/LPC11Cxx Power Monitor Unit (PMU)
Description
Data retained during Deep power-down mode.
DD
DD
Description
Sleep mode flag
Read: No power-down mode entered.
LPC111x/LPC11Cxx is in Active mode.
Write: No effect.
Read: Sleep/Deep-sleep or Deep power-down mode
entered.
Write: Writing a 1 clears the SLEEPFLAG bit to 0.
Reserved. Do not write ones to this bit.
Deep power-down flag
Read: Deep power-down mode not entered.
Write: No effect.
Read: Deep power-down mode entered.
Write: Clear the Deep power-down flag.
Reserved. Do not write ones to this bit.
pin but the chip has entered Deep power-down mode.
pin but the chip has entered Deep power-down mode.
Description
Reserved. Do not write ones to this bit.
UM10398
© NXP B.V. 2012. All rights reserved.
DD
drops below
…continued
Reset
value
0x0
54 of 538
Reset
value
0
0x0
0x0
0x0
0x0
0x0
Reset
value
0x0
Related parts for LPC1113FHN33/303,5
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: