MAX7304ETG+T Maxim Integrated, MAX7304ETG+T Datasheet - Page 27

• Manufacturer Part Number: MAX7304ETG+T
• Description: LED Lighting Drivers I2C 16Port LT GPIO and LED Driver
• Manufacturer: Maxim Integrated

Specifications of MAX7304ETG+T

• Rohs: yes

For the latest application details on WLP construction,
dimensions, tape-carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reliability
testing results, refer to Application Note 1891: Wafer-
Level Packaging (WLP) and Its Applications, available at
www.maximintegrated.com.
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
Maxim Integrated
PACKAGE TYPE
24 TQFN-EP
Wafer-Level Packaging (WLP)
25 WLP
with High Level of Integrated ESD Protection
Applications Information
Level-Translating GPIO and LED Driver
PACKAGE CODE
W252F2+1
T243A3+1
PROCESS: BiCMOS
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
**Future product—contact factory for availability.
MAX7304ETG+
MAX7304EWA+**
I
2
OUTLINE NO.
PART
C-Interfaced 16-Port,
21-0188
21-0453
-40NC to +85NC
-40NC to +85NC
TEMP RANGE
Package Information
Ordering Information
Refer to
Chip Information
LAND PATTERN NO.
MAX7304
Application Note 1891
PIN-PACKAGE
24 TQFN-EP*
25 WLP
90-0122
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