MAX6745XKVD3+T Maxim Integrated, MAX6745XKVD3+T Datasheet - Page 4

• Manufacturer Part Number: MAX6745XKVD3+T
• Description: Supervisory Circuits MCU Supervisor
• Manufacturer: Maxim Integrated
• Series: MAX6736, MAX6737, MAX6738, MAX6739, MAX6740, MAX6741, MAX6742, MAX6743, MAX6744, MAX6745r

Specifications of MAX6745XKVD3+T

• Rohs: yes
• Number Of Voltages Monitored: 2
• Monitored Voltage: 1.8 V to 5 V, 0.9 V to 3.3 V
• Undervoltage Threshold: 1.53 V, 0.765 V
• Overvoltage Threshold: 1.62 V, 0.81 V
• Output Type: Active Low, Push-Pull
• Manual Reset: Not Resettable
• Watchdog: No Watchdog
• Battery Backup Switching: No Backup
• Power-up Reset Delay (typ): 225 ms
• Supply Voltage - Max: 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: SC-70
• Chip Enable Signals: No
• Maximum Power Dissipation: 247 mW
• Minimum Operating Temperature: - 40 C
• Power Fail Detection: Yes
• Supply Current (typ): 5 uA, 10 uA
• Supply Voltage - Min: 1 V

MAXQ613
16-Bit Microcontroller with Infrared Module
Voltage Range on V
Voltage Range on Any Lead with
Continuous Power Dissipation (T
ABSOLUTE MAXIMUM RATINGS
4
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
(V
Supply Voltage
1.8V Internal Regulator
Power-Fail Warning Voltage for
Supply
Power-Fail Reset Voltage
POR Voltage
RAM Data-Retention Voltage
Active Current
Stop-Mode Current
Current Consumption During
Power-Fail
Power Consumption During
POR
Stop-Mode Resume Time
Power-Fail Monitor Startup
Time
Power-Fail Warning Detection
Time
Input Low Voltage for IRTX,
IRRX, RESET, and All Port Pins
Input High Voltage for IRTX,
IRRX, RESET, and All Port Pins
Respect to GND Except V
32 TQFN (single-layer board)
(derate 21.3mW/NC above +70NC)..........................1702.1mW
32 TQFN (multilayer board)
(derate 34.5mW/NC above +70NC)..........................2758.6mW
DD
= V
RST
PARAMETER
to 3.6V, T
DD
A
with Respect to GND .....-0.3V to +3.6V
= 0NC to +70NC, unless otherwise noted.) (Note 1)
DD
............... -0.3V to (V
A
= +70NC)
SYMBOL
t
V
PFM_ON
V
V
I
V
REG18
V
I
t
DD_1
V
I
POR
t
PFW
V
I
I
PFR
V
PFW
POR
DRV
ON
RST
DD
S1
S2
IH
IL
Monitors V
Monitors V
Monitors V
(Note 4)
Sysclk = 12MHz (Note 5)
Power-Fail Off
Power-Fail On
(Note 6)
(Note 7)
(Note 4)
(Note 8)
DD
+ 0.5V)
DD
DD
DD
CONDITIONS
(Note 2)
(Note 3)
T
T
T
T
A
A
A
A
= +25NC
= 0°C to +70NC
= +25NC
= 0°C to +70NC
Operating Temperature Range ............................. 0NC to +70NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (excluding dice; soldering, 10s) ......+300NC
Soldering Temperature (reflow) ......................................+260NC
44 TQFN (single-layer board)
(derate 27mW/NC above +70NC).............................2162.2mW
44 TQFN (multilayer board)
(derate 37mW/NC above +70NC)................................2963mW
0.7 x V
V
V
1.62
1.75
1.64
MIN
1.0
GND
10
RST
1
DD
((PCI - 3) x (I
375 + (8192 x
I
NANO
[(3 x I
t
HFXIN)
TYP
1.67
3.25
27.6
100
1.8
1.8
0.2
0.2
22
))]/PCI
S2
) +
S1
+
0.3 x V
MAX
1.98
1.85
1.70
1.42
29.5
V
150
3.6
2.0
42
Maxim Integrated
4
8
DD
DD
UNITS
mA
FA
FA
nA
Fs
Fs
Fs
V
V
V
V
V
V
V
V