C8051F330DR Silicon Labs, C8051F330DR Datasheet - Page 3

• Manufacturer Part Number: C8051F330DR
• Description: 8-bit Microcontrollers - MCU 8kB 10ADC
• Manufacturer: Silicon Labs

Specifications of C8051F330DR

• Product Category: 8-bit Microcontrollers - MCU
• Core: 8051
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 25 MHz
• Program Memory Size: 8 KB
• Data Ram Size: 768 B
• On-chip Adc: No
• Operating Supply Voltage: 2.7 V to 3.6 V
• Package / Case: QFN-20
• Mounting Style: SMD/SMT
• Data Rom Size: 128 B
• Interface Type: I2C, SPI, UART
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• On-chip Dac: No
• Processor Series: C8051
• Program Memory Type: Flash
• Factory Pack Quantity: 1500
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.7 V

Table of Contents
1. System Overview.................................................................................................... 17
2. Absolute Maximum Ratings .................................................................................. 31
3. Global Electrical Characteristics .......................................................................... 32
4. Pinout and Package Definitions............................................................................ 35
5. 10-Bit ADC (ADC0, C8051F330/2/4 only) .............................................................. 41
6. 10-Bit Current Mode DAC (IDA0, C8051F330 only).............................................. 57
7. Voltage Reference (C8051F330/2/4 only).............................................................. 61
8. Comparator0 ........................................................................................................... 65
9. CIP-51 Microcontroller ........................................................................................... 71
1.1. CIP-51™ Microcontroller Core.......................................................................... 22
1.2. On-Chip Memory............................................................................................... 24
1.3. On-Chip Debug Circuitry................................................................................... 25
1.4. Programmable Digital I/O and Crossbar ........................................................... 26
1.5. Serial Ports ....................................................................................................... 26
1.6. Programmable Counter Array ........................................................................... 27
1.7. 10-Bit Analog to Digital Converter..................................................................... 28
1.8. Comparators ..................................................................................................... 29
1.9. 10-bit Current Output DAC................................................................................ 30
5.1. Analog Multiplexer ............................................................................................ 41
5.2. Temperature Sensor ......................................................................................... 42
5.3. Modes of Operation .......................................................................................... 43
5.4. Programmable Window Detector ...................................................................... 51
6.1. IDA0 Output Scheduling ................................................................................... 57
6.2. IDAC Output Mapping....................................................................................... 58
9.1. Instruction Set ................................................................................................... 72
9.2. Memory Organization........................................................................................ 76
1.1.1. Fully 8051 Compatible.............................................................................. 22
1.1.2. Improved Throughput ............................................................................... 22
1.1.3. Additional Features .................................................................................. 23
5.3.1. Starting a Conversion............................................................................... 44
5.3.2. Tracking Modes........................................................................................ 45
5.3.3. Settling Time Requirements ..................................................................... 46
5.4.1. Window Detector In Single-Ended Mode ................................................. 53
5.4.2. Window Detector In Differential Mode...................................................... 54
6.1.1. Update Output On-Demand ..................................................................... 57
6.1.2. Update Output Based on Timer Overflow ................................................ 58
6.1.3. Update Output Based on CNVSTR Edge................................................. 58
9.1.1. Instruction and CPU Timing ..................................................................... 72
9.1.2. MOVX Instruction and Program Memory ................................................. 72
9.2.1. Program Memory...................................................................................... 77
9.2.2. Data Memory............................................................................................ 78
9.2.3. General Purpose Registers ...................................................................... 78
9.2.4. Bit Addressable Locations........................................................................ 78
Rev. 1.7
C8051F330/1/2/3/4/5
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