MT46V32M16TG-6T IT:F TR Micron Technology Inc, MT46V32M16TG-6T IT:F TR Datasheet - Page 82
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MT46V32M16TG-6T IT:F TR
Manufacturer Part Number
MT46V32M16TG-6T IT:F TR
Description
IC DDR SDRAM 512MBIT 6NS 66TSOP
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet
1.MT46V32M16P-5BF_TR.pdf
(91 pages)
Specifications of MT46V32M16TG-6T IT:F TR
Format - Memory
RAM
Memory Type
DDR SDRAM
Memory Size
512M (32Mx16)
Speed
6ns
Interface
Parallel
Voltage - Supply
2.3 V ~ 2.7 V
Operating Temperature
-40°C ~ 85°C
Package / Case
66-TSOP
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
700ps
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Package Type
TSOP
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Supply Current
195mA
Pin Count
66
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Figure 47:
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
DDR_x4x8x16_Core2.fm - 512Mb DDR: Rev. N; Core DDR Rev. B 2/09 EN
Command
Address
t DQSS (NOM)
t DQSS (MIN)
t DQSS (MAX)
DQS
DQS
DQS
CK#
DM
DM
DM
DQ
DQ
DQ
CK
WRITE-to-PRECHARGE – Odd Number of Data, Interrupting
Bank a,
Notes:
WRITE
Col b
T0
t DQSS
t DQSS
t DQSS
1. DI b = data-in for column b.
2. An interrupted burst of 8 is shown; one data element is written.
3.
4. A10 is LOW with the WRITE command (auto precharge is disabled).
5. DQS is required at T4 and T4n (nominal case) to register DM.
6. If the burst of 4 is used, DQS and DM are not required at T3, T3n, T4, and T4n.
t
DI
b
WR is referenced from the first positive CK edge after the last data-in pair.
NOP
DI
T1
b
DI
b
T1n
NOP
T2
T2n
t WR
82
NOP
T3
T3n
Micron Technology, Inc., reserves the right to change products or specifications without notice.
(a or all)
Bank,
T4
PRE
512Mb: x4, x8, x16 DDR SDRAM
T4n
Transitioning Data
T5
NOP
©2000 Micron Technology, Inc. All rights reserved.
t RP
T6
NOP
Operations
Don’t Care