M27C4001-12F6 STMicroelectronics, M27C4001-12F6 Datasheet - Page 5

• Manufacturer Part Number: M27C4001-12F6
• Description: IC EPROM 4MBIT 120NS 32CDIP
• Manufacturer: STMicroelectronics

Specifications of M27C4001-12F6

• Format - Memory: EPROMs
• Memory Type: UV EPROM
• Memory Size: 4M (512K x 8)
• Speed: 120ns
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-CDIP (0.600", 15.24mm) Window
• Capacitance, Input: 6 pF
• Capacitance, Output: 12 pF
• Current, Input, Leakage: ±10 μA (Read)
• Current, Operating: 30 mA (Read)
• Current, Output, Leakage: ±10 μA (Read)
• Current, Supply: 30 mA
• Density: 4M
• Organization: 512K×8
• Package Type: FDIP32W
• Temperature, Operating: -40 to +85 °C
• Temperature, Operating, Maximum: 85 °C
• Temperature, Operating, Minimum: -40 °C
• Time, Access: 100 ns
• Time, Fall: ≤20 ns
• Time, Programmable: 100 μs
• Time, Rise: ≤20 ns
• Voltage, Input, High: 6 V (Read)
• Voltage, Input, High Level: 2 V (Min.)
• Voltage, Input, Low: 0.8 V (Read)
• Voltage, Input, Low Level: -0.3 V (Max.)
• Voltage, Output, High: 4.3 V (Read)
• Voltage, Output, Low: 0.4 V (Read)
• Voltage, Programmable: 11.5 V (Min.)
• Voltage, Supply: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

M27C4001
1
Summary description
The M27C4001 is a 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and
OTP (one time programmable). It is ideally suited for microprocessor systems requiring
large programs and is organised as 524,288 by 8 bits.
The FDIP32W (window ceramic frit-seal package) has a transparent lid which allows the
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27C4001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.
In order to meet environmental requirements, ST offers the M27C4001 in ECOPACK®
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 1.
Table 1.
A0-A18
Q0-Q7
E
G
V
V
V
PP
CC
SS
Logic Diagram
Signal names
A0-A18
G
E
19
Address Inputs
Data Outputs
Chip Enable
Output Enable
Program Supply
Supply Voltage
Ground
V CC
M27C4001
V SS
V PP
8
Q0-Q7
AI00721B
Summary description
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