LNK364PN Power Integrations, LNK364PN Datasheet - Page 14

IC OFFLINE SWIT HV 8DIP

LNK364PN

Manufacturer Part Number
LNK364PN
Description
IC OFFLINE SWIT HV 8DIP
Manufacturer
Power Integrations
Series
LinkSwitch®-XTr
Type
Off Line Switcherr
Datasheet

Specifications of LNK364PN

Output Isolation
Isolated
Frequency Range
124 ~ 140kHz
Voltage - Output
700V
Power (watts)
9W
Operating Temperature
-40°C ~ 150°C
Package / Case
8-DIP (0.300", 7.62mm), 7 Leads
Output Voltage
5.8 V
Input / Supply Voltage (max)
265 VAC
Input / Supply Voltage (min)
85 VAC
Duty Cycle (max)
60 %
Switching Frequency
132 KHz
Supply Current
250 uA
Operating Temperature Range
- 40 C to + 150 C
Mounting Style
Through Hole
For Use With
596-1105 - DESIGN ACCELERATOR KIT XT SWITCH
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
596-1088-2
596-1088-2
596-1088-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LNK364PN
Manufacturer:
PowerInt
Quantity:
2 300
Part Number:
LNK364PN
Manufacturer:
POWER
Quantity:
20 000
Company:
Part Number:
LNK364PN
Quantity:
14
Rev. E 11/08
2-14
14
.240 (6.10)
.260 (6.60)
14
.100 (2.54) BSC
.125 (3.18)
.145 (3.68)
-T-
.032 (.81)
.037 (.94)
Pin 1
.125 (3.18)
.145 (3.68)
-E-
.240 (6.10)
.260 (6.60)
-D-
SEATING
PLANE
Pin 1
-E-
-D-
LNK362-364
.014 (.36)
.022 (.56)
.367 (9.32)
.387 (9.83)
D S .004 (.10)
D S .004 (.10)
.100 (2.54) (BSC)
.367 (9.32)
.387 (9.83)
.048 (1.22)
.053 (1.35)
T E D S .010 (.25) M
.048 (1.22)
.053 (1.35)
.137 (3.48)
.009 (.23)
MINIMUM
.137 (3.48)
MINIMUM
.372 (9.45)
.388 (9.86)
E S
.057 (1.45)
.068 (1.73)
.120 (3.05)
.140 (3.56)
.057 (1.45)
.068 (1.73)
MINIMUM
(NOTE 6)
.015 (.38)
(NOTE 5)
.010 (.25)
SMD-8B
DIP-8B
.004 (.10)
.012 (.30)
Notes:
1. Package dimensions conform to JEDEC specification
2. Controlling dimensions are inches. Millimeter sizes are
3. Dimensions shown do not include mold flash or other
4. Pin locations start with Pin 1, and continue counter-clock-
5. Minimum metal to metal spacing at the package body for
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
Pin 1
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
shown in parentheses.
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
the omitted lead location is .137 inch (3.48 mm).
perpendicular to plane T.
Solder Pad Dimensions
.004 (.10)
.046 .060
.008 (.20)
.015 (.38)
.086
.300 (7.62) BSC
.186
.036 (0.91)
.044 (1.12)
.300 (7.62)
.390 (9.91)
(NOTE 7)
.286
.060 .046
.080
.420
0 -
°
8
Notes:
1. Controlling dimensions are
2. Dimensions shown do not
3. Pin locations start with Pin 1,
4. Minimum metal to metal
5. Lead width measured at
6. D and E are referenced
°
inches. Millimeter sizes are
shown in parentheses.
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 6 is omitted.
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
package body.
datums on the package
body.
PI-2551-121504
PI-2546-121504
G08B
P08B

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