LTC1647-3CGN#TRPBF Linear Technology, LTC1647-3CGN#TRPBF Datasheet - Page 13
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LTC1647-3CGN#TRPBF
Manufacturer Part Number
LTC1647-3CGN#TRPBF
Description
IC CTRLR HOTSWAP DUAL 16SSOP
Manufacturer
Linear Technology
Type
Hot-Swap Controllerr
Specifications of LTC1647-3CGN#TRPBF
Applications
General Purpose
Internal Switch(s)
No
Voltage - Supply
2.7 V ~ 16.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
16-SSOP (0.150", 3.90mm Width)
Linear Misc Type
Positive Low Voltage
Family Name
LTC1647-3
Package Type
SSOP N
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
16.5V
Operating Temperature (min)
0C
Operating Temperature (max)
70C
Operating Temperature Classification
Commercial
Product Depth (mm)
3.99mm
Product Height (mm)
1.5mm
Mounting
Surface Mount
Pin Count
16
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LTC1647-3CGN#TRPBFLTC1647-3CGN#PBF
Manufacturer:
Linear Technology
Quantity:
135
APPLICATIONS INFORMATION
Autoretry
The LTC1647-2 and LTC1647-3 are designed to allow an
automatic reset of the electronic circuit breaker after a
fault condition occurs. This is accomplished by pulling
the ON/FAULT (LTC1647-2) pin or the ON and FAULT pins
tied together (LTC1647-3) high through a resistor, R3, as
shown in Figure 7. An autoretry sequence begins if a fault
occurs. If the circuit breaker trips, FAULT pulls the ON
pin low. After a t
R3 pulls the ON pin up. C3 delays GATE turn-on until the
voltage at the ON pin exceeds V
GATE ramps up at 10μA/C1 until Q1 conducts. If V
still shorted to GND, the cycle repeats. The ramp interval
is about t
voltage of the external MOSFET.
Hot Circuit Insertion
When circuit boards are inserted into a live backplane or
a device bay, the supply bypass capacitors on the board
can draw huge transient currents from the backplane or
the device bay power bus as they charge up. The transient
currents can damage the connector pins and glitch the
system supply, causing other boards in the system to
reset or malfunction.
The LTC1647 is designed to turn two positive supplies on
and off in a controlled manner, allowing boards to be safely
inserted or removed from a live backplane or device bay.
The LTC1647 can be located before or after the connector
as shown in Figure 8. A staggered PCB connector can
sequence pin conections when plugging and unplugging
circuit boards. Alternatively, the control signal can be
generated by processor control.
Ringing
Good engineering practice calls for bypassing the supply
rail of any circuit. Bypass capacitors are often placed at
the supply connection of every active device, in addition
to one or more large value bulk bypass capacitors per
supply rail. If power is connected abruptly, the bypass
t
DELAY
RAMP
= –R3•C3•ln[1–(V
= V
RESET
TH
•C1/10μA where V
interval elapses, FAULT resets and
IH
– V
IH
OL
. The delay time is
)/(V
TH
ON
is the threshold
– V
OL
)]
OUT
is
capacitors slow the rate of rise of voltage and heavily
damp any parasitic resonance of lead or trace inductance
working against the supply bypass capacitors.
The opposite is true for LTC1647 Hot Swap circuits on a
daughterboard. In most cases, on the powered side of the
MOSFET switch (V
present. An abrupt connection, produced by plugging a
board into a backplane connector, results in a fast rising
edge applied to the V
No bulk capacitance is present to slow the rate of rise and
heavily damp the parasitic resonance. Instead, the fast edge
shock excites a resonant circuit formed by a combination
of wiring harness, backplane and circuit board parasitic
inductances and MOSFET capacitance. In theory, the peak
voltage should rise to 2X the input supply, but in practice
the peak can reach 2.5X, owing to the effects of voltage
dependent MOSFET capacitance.
The absolute maximum V
17V; any circuit with an input of more than 6.8V should be
scrutinized for ringing. A well-bypassed backplane should
not escape suspicion: circuit board trace inductances
of as little as 10nH can produce sufficient ringing to
overvoltage V
Check ringing with a fast storage oscilloscope (such as a
LECROY 9314AL DSO) by attaching coax or a probe to V
and GND, then repeatedly inserting the circuit board into
the backplane. Figures 9a and 9b show typical results in a
12V application with different V
amplitude reaches 22V, breaking down the ESD protection
diode in the process.
There are two methods for eliminating ringing: clipping
and snubbing. A transient voltage suppressor is an
effec tive means of limiting peak voltage to a safe level.
Figure 10 shows the effect of adding an ON Semiconduc-
tor, 1SMA12CAT3, on the waveform of Figure 9.
Figures 11a and 11b show the effects of snubbing with
different RC networks. The capacitor value is chosen as
10X to 100X the MOSFET C
for best damping—1Ω to 50Ω depending on the value of
parasitic inductance.
LTC1647-2/LTC1647-3
CC
.
CC
) there is no supply bypass capacitor
CC
line of the LTC1647.
CC
OSS
potential for the LTC1647 is
under bias and R is selected
CC
LTC1647-1/
lead lengths. The peak
13
1647fa
CC