HCPL-0601-500E Avago Technologies US Inc., HCPL-0601-500E Datasheet - Page 8

OPTOCOUPLER LOG-OUT 10MBD 8SOIC

HCPL-0601-500E

Manufacturer Part Number
HCPL-0601-500E
Description
OPTOCOUPLER LOG-OUT 10MBD 8SOIC
Manufacturer
Avago Technologies US Inc.
Datasheets

Specifications of HCPL-0601-500E

Package / Case
8-SOIC (0.154", 3.90mm Width)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
50mA
Data Rate
10MBd
Propagation Delay High - Low @ If
50ns @ 7.5mA
Current - Dc Forward (if)
20mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Surface Mount
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
50 mA
Maximum Fall Time
0.01 us
Maximum Forward Diode Current
20 mA
Minimum Forward Diode Voltage
1.4 V
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
10 MBd(Typ)
Maximum Forward Diode Voltage
1.75 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
85 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
No. Of Channels
1
Optocoupler Output Type
Logic Gate
Input Current
15mA
Output Voltage
7V
Opto Case Style
SOIC
No. Of Pins
8
Supply Voltage Min
4.5V
Rohs Compliant
Yes
External Depth
6.35mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1774-2
HCPL-0601-500E

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Recommended Pb-free IR Profile
Regulatory Information
The 6N137, HCPL-26XX/06XX/46XX, and HCNW137/26XX have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
Insulation and Safety Related Specifications
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
8
Parameter
Minimum External
Air Gap (External
Clearance)
Minimum External
Tracking (External
Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Minimum Internal
Tracking (Internal
Creepage)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
T
T
smax
smin
25
T
T
p
L
217 °C
150 - 200 °C
t 25 °C to PEAK
60 to 180 SEC.
PREHEAT
3 °C/SEC. MAX.
t
s
Symbol
L(101)
L(102)
RAMP-UP
CTI
* 260 +0/-5 °C
TIME
8-pin DIP
(300 Mil)
Value
0.08
200
7.1
7.4
NA
IIIa
t
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
Value
SO-8
0.08
200
4.9
4.8
NA
IIIa
RAMP-DOWN
6 °C/SEC. MAX.
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(Option 060 and HCNW only)
Widebody
(400 Mil)
Value
10.0
200
9.6
1.0
4.0
IIIa
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR
Units
Volts
smax
mm
mm
mm
mm
WIDEBODY 400mils PACKAGE IS 245 °C
= 200 °C, T
Conditions
Measured from input terminals
to output terminals, shortest
distance through air.
Measured from input terminals
to output terminals, shortest
distance path along body.
Through insulation distance,
conductor to conductor, usually
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Measured from input terminals
to output terminals, along
internal cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group
(DIN VDE 0110, 1/89, Table 1)
smin
= 150 °C

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