HCNW136-000E Avago Technologies US Inc., HCNW136-000E Datasheet - Page 9
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HCNW136-000E
Manufacturer Part Number
HCNW136-000E
Description
OPTOCOUPLER T-OUT 1MBD 8DIP WIDE
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0500-000E.pdf
(17 pages)
Specifications of HCNW136-000E
Input Type
DC
Package / Case
8-DIP (0.400", 10.16mm)
Voltage - Isolation
5000Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
8mA
Data Rate
1Mbps
Propagation Delay High - Low @ If
200ns @ 16mA
Current - Dc Forward (if)
25mA
Output Type
Open Collector
Mounting Type
Through Hole
Isolation Voltage
5000 Vrms
Minimum Forward Diode Voltage
1.45 V
Output Device
Transistor With Base
Configuration
1 Channel
Current Transfer Ratio
50 %
Maximum Baud Rate
1 MBps
Maximum Forward Diode Voltage
1.85 V
Maximum Reverse Diode Voltage
3 V
Maximum Input Diode Current
25 mA
Maximum Power Dissipation
100 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 55 C
No. Of Channels
1
Optocoupler Output Type
Phototransistor
Input Current
16mA
Output Voltage
20V
Opto Case Style
DIP
No. Of Pins
8
Ctr Max
50%
Ctr Min
19%
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1524-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCNW136-000E
Manufacturer:
AVAGO
Quantity:
8 290
Part Number:
HCNW136-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
9
Absolute Maximum Ratings
*Data has been registered with JEDEC for the 6N135/6N136.
Parameter
Storage Temperature*
Operating Temperature*
Average Forward Input Current*
Peak Forward Input Current*
Peak Transient Input Current*
Reverse LED Input Voltage* (Pin 3-2)
Input Power Dissipation*
Average Output Current* (Pin 6)
Peak Output Current*
Emitter-Base Reverse Voltage* (Pin 5-7)
Supply Voltage (Pin 8-5)
Output Voltage (Pin 6-5)
Supply Voltage* (Pin 8-5)
Output Voltage* (Pin 6-5)
Base Current* (Pin 7)
Output Power Dissipation*
Lead Solder Temperature*
(Through-Hole Parts Only)
Reflow Temperature Profile
(50% duty cycle, 1 ms pulse width)
(50% duty cycle, 1 ms pulse width)
(≤1 µs pulse width, 300 pps)
1.6 mm below seating plane, 10 seconds
up to seating plane, 10 seconds
Symbol
I
I
I
F(TRANS)
I
I
O(PEAK)
F(PEAK)
O(AVG)
F(AVG)
V
V
V
T
P
T
V
V
P
T
T
V
EBR
I
CC
CC
B
LS
RP
A
IN
O
O
S
R
O
Option 300
Widebody
Widebody
Widebody
Widebody
Widebody
Widebody
8-Pin DIP
8-Pin DIP
8-Pin DIP
8-Pin DIP
8-Pin DIP
8-Pin DIP
SO-8 and
Device
SO-8
SO-8
SO-8
SO-8
SO-8
Min.
-0.5
-0.5
-0.5
-0.5
See Package Outline Drawings
-55
-55
-55
section
Max.
125
100
100
260
260
0.1
85
25
50
40
45
40
16
30
20
15
15
1
5
3
8
5
5
Units
mW
mW
mA
mA
mA
mA
mA
°C
°C
°C
°C
A
V
V
V
V
V
V
Note
1
2
3
4