FOD815 Fairchild Optoelectronics Group, FOD815 Datasheet
FOD815
Specifications of FOD815
Related parts for FOD815
FOD815 Summary of contents
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... FOD815 Series Rev. 1.0.4 Applications ■ Power supply regulators ■ Digital logic inputs ■ Microprocessor inputs Description The FOD815 consists of a gallium arsenide infrared emitting diode, driving a silicon photodarlington output in a 4-pin dual in-line package. 4 COLLECTOR 3 EMITTER (T = 25°C Unless otherwise specified.) ...
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... C t Response Time (Rise Response Time (Fall) f Isolation Characteristics Symbol Characteristic V Input-Output Isolation ISO Voltage R Isolation Resistance iso C Floating Capacitance f Note: 1. Current Transfer Ratio (CTR FOD815 Series Rev. 1.0 25°C Unless otherwise specified.) A Test Conditions I = 20mA 1kHz V = 10V 0.1mA 10µ ...
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... FORWARD CURRENT I F (mA) Fig. 5 Current Transfer Ratio vs. Forward Current 2000 1600 1200 800 400 0 0.1 0.2 0.5 FORWARD CURRENT I F (mA) FOD815 Series Rev. 1.0 200 150 100 100 125 -30 Fig. 4 Forward Current vs. Forward Voltage 500 Ta = 25°C 200 ...
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... AMBIENT TEMPERATURE T A (°C) Fig. 11. Frequency Response 0 -10 R =10kΩ 1kΩ L -20 0.02 0.1 1 FREQUENCY f (kHz) FOD815 Series Rev. 1.0.4 (T Fig. 8 Collector-Emitter Saturation Voltage I = 5mA 100 75 100 Test Circuit for Response Time 2mA 25° Input 100Ω Test Circuit for Frequency Response ...
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... Note: All dimensions are in inches (millimeters) FOD815 Series Rev. 1.0.4 0.312 (7.92) 0.288 (7.32) 0.276 (7.00) 0.236 (6.00) 0.051 (1.30) 0.043 (1.10) 0.010 (0.26) 0.110 (2.79) 0.090 (2.29) ...
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... Ordering Information Option Order Entry Identifi 300 300W 3S 3SD Marking Information Definitions FOD815 Series Rev. 1.0.4 .S .SD Surface Mount; Tape and reel .W .300 .300W VDE Approved, 0.4" Lead Spacing .3S VDE Approved, Surface Mount .3SD VDE Approved, Surface Mount, Tape & Reel ...
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... Carrier Tape Specifications Ø1.55±0.05 Note: All dimensions are in millimeters. Description Tape wide Pitch of sprocket holes Distance of compartment Distance of compartment to compartment Compartment FOD815 Series Rev. 1.0 Symbol Dimensions in mm (inches ± 0.3 (.63 ± 0.1 (.15 7.5 ± 0.1 (.295 ± 0.1 (.079) ...
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... Preheat condition (Tsmin-Tsmax / ts) Melt soldering zone Peak temperature (Tp) Ramp-down rate Recommended Wave Soldering condition Profile Feature Peak temperature (Tp) FOD815 Series Rev. 1.0.4 ts (Preheat) Time (sec) Pb-Sn solder assembly 100°C ~ 150° 120 sec 183° 120 sec 240 +0/-5°C 6° ...
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... PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete FOD815 Series Rev. 1.0.4 ISOPLANAR™ PowerEdge™ LittleFET™ PowerSaver™ MICROCOUPLER™ PowerTrench ® MicroFET™ ...