TLP627-4 Toshiba, TLP627-4 Datasheet - Page 9

PHOTOCPLR QUAD HS DARL-OUT 16DIP

TLP627-4

Manufacturer Part Number
TLP627-4
Description
PHOTOCPLR QUAD HS DARL-OUT 16DIP
Manufacturer
Toshiba
Datasheets

Specifications of TLP627-4

Number Of Channels
4
Input Type
DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
1000% @ 1mA
Voltage - Output
300V
Current - Output / Channel
150mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
1.2V
Output Type
Darlington
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
No. Of Channels
4
Isolation Voltage
5kV
Optocoupler Output Type
Photodarlington
Input Current
16mA
Output Voltage
300V
Opto Case Style
DIP
No. Of Pins
16
Approval Bodies
UL
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current Transfer Ratio (max)
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TLP627-4
Manufacturer:
TOSHIBA
Quantity:
9 215
Part Number:
TLP627-4
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
TLP627-4(F)
Manufacturer:
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Quantity:
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Part Number:
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0
Photocoupler Product Tree
3
DIP8
Package
Photocoupler Product Tree
DIP4
Photorelays
Photorelays
2.54SOP4
Triac Output
Thyristor- and Triac-Output
DIP16
SOP4
SO8
2.54SOP6
ZC
DIP6
Transistor-Output
Thyristor Output
SDIP6
SO6
SO16
SOP16
MFSOP6
2.54SOP8
SSOP4
USOP4
Transistor-Output
Output Choices
2.54SOP4
2.54SOP8
MFSOP6
SSOP4
USOP4
SOP16
SDIP6
SOP4
SO16
DIP4
DIP8
SO6
SO8
9
Darlington-Transistor Output
Photovoltaic-Output
Photovoltaic-Output
2.54SOP6
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SMD package (1.27-mm lead pitch)
SMD package (2.54-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
DIP16
DIP6
General-purpose packages
Lead-forming options for surface mounting
Logic Output
Gate Drive
IC-Output
GND
GND
Vcc
V
CC

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