KIT33887EKEVBE Freescale Semiconductor, KIT33887EKEVBE Datasheet - Page 26
![BOARD EVALUATION FOR MC33887](/photos/37/57/375700/kit33887ekevbe_bd_sml.jpg)
KIT33887EKEVBE
Manufacturer Part Number
KIT33887EKEVBE
Description
BOARD EVALUATION FOR MC33887
Manufacturer
Freescale Semiconductor
Type
Charge Pumpsr
Specifications of KIT33887EKEVBE
Main Purpose
Power Management, H Bridge Driver (Internal FET)
Embedded
No
Utilized Ic / Part
MC33887
Primary Attributes
5A, 5 ~ 28V, PWM to 20kHz, Active Current Limit
Secondary Attributes
Fault Status, Sleep Mode, Proportional Current Mirror Output
Input Voltage
8 V to 20 V
Board Size
50.8 mm x 50.8 mm
Maximum Operating Temperature
+ 85 C
Product
Power Management Modules
Dimensions
50.8 mm x 50.8 mm
Silicon Manufacturer
Freescale
Silicon Core Number
MC33887
Kit Application Type
Power Management - Motor Control
Application Sub Type
DC Brushed Motor
Kit Contents
Board, CD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
MC33887
performance. The significant feature of these packages is the
exposed pad on which the power die is soldered. When
soldered to a PCB, this pad provides a path for heat flow to
the ambient environment. The more copper area and
thickness on the PCB, the better the power dissipation and
transient behavior will be.
bottom side area of copper is 7.8 cm
(see
26
33887
PACKAGING
SOLDERING INFORMATION
The 33887 packages are designed for thermal
Example Characterization on a double-sided PCB:
Figure
); grid array of 24 vias 0.3 mm in diameter
2
; top surface is 2.7 cm
SOLDERING INFORMATION
PACKAGING
2
.
Top Side
Figure 24. PCB Test Layout
Analog Integrated Circuit Device Data
Freescale Semiconductor
Bottom Side