KIT33887EKEVBE Freescale Semiconductor, KIT33887EKEVBE Datasheet - Page 26

• Manufacturer Part Number: KIT33887EKEVBE
• Description: BOARD EVALUATION FOR MC33887
• Manufacturer: Freescale Semiconductor
• Type: Charge Pumpsr

Specifications of KIT33887EKEVBE

• Main Purpose: Power Management, H Bridge Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: MC33887
• Primary Attributes: 5A, 5 ~ 28V, PWM to 20kHz, Active Current Limit
• Secondary Attributes: Fault Status, Sleep Mode, Proportional Current Mirror Output
• Input Voltage: 8 V to 20 V
• Board Size: 50.8 mm x 50.8 mm
• Maximum Operating Temperature: + 85 C
• Product: Power Management Modules
• Dimensions: 50.8 mm x 50.8 mm
• Silicon Manufacturer: Freescale
• Silicon Core Number: MC33887
• Kit Application Type: Power Management - Motor Control
• Application Sub Type: DC Brushed Motor
• Kit Contents: Board, CD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: MC33887

performance. The significant feature of these packages is the
exposed pad on which the power die is soldered. When
soldered to a PCB, this pad provides a path for heat flow to
the ambient environment. The more copper area and
thickness on the PCB, the better the power dissipation and
transient behavior will be.
bottom side area of copper is 7.8 cm
(see
26
33887
PACKAGING
SOLDERING INFORMATION
The 33887 packages are designed for thermal
Example Characterization on a double-sided PCB:
Figure
); grid array of 24 vias 0.3 mm in diameter
2
; top surface is 2.7 cm
SOLDERING INFORMATION
PACKAGING
2
.
Top Side
Figure 24. PCB Test Layout
Analog Integrated Circuit Device Data
Freescale Semiconductor
Bottom Side