KIT33742DWEVB Freescale Semiconductor, KIT33742DWEVB Datasheet - Page 67

• Manufacturer Part Number: KIT33742DWEVB
• Description: KIT FOR 33742 SBC WITH EHSCAN
• Manufacturer: Freescale Semiconductor

Specifications of KIT33742DWEVB

• Main Purpose: Interface, CAN Controller
• Utilized Ic / Part: MC33742
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Secondary Attributes: -
• Embedded: -
• Primary Attributes: -

Device on Thermal Test Board
Analog Integrated Circuit Device Data
Freescale Semiconductor
Material:
Outline:
Area A:
Ambient Conditions: Natural convection, still air
V2CTRL
VSUP
GND
GND
GND
GND
RXD
VDD
TXD
RST
INT
HS
V2
L0
18.0 mm x 7.5 mm Body
33742 Pin Connections
28-Pin SOICW
1.27 mm Pitch
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Single layer printed circuit board
FR4, 1.6mm thickness
Cu traces, 0.07mm thickness
80mm x 100mm board area,
including edge connector for thermal
testing
Cu heat-spreading areas on board
surface
28
27
26
25
24
23
22
21
20
19
18
17
16
15
WDOG
CS
MOSI
MISO
SCLK
GND
GND
GND
GND
CANL
CANH
L3
L2
L1
Figure 39. Thermal Test Board
A
Table 44. Thermal Resistance Performance
ambient air.
R
θJA
is the thermal resistance between die junction and
A [mm²]
300
600
0
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
R
θJA
68
52
47
[°C/W]
33742
67