R0K561622S000BE Renesas Electronics America, R0K561622S000BE Datasheet - Page 33

• Manufacturer Part Number: R0K561622S000BE
• Description: KIT STARTER FOR H8SX/1622
• Manufacturer: Renesas Electronics America
• Series: Renesas Starter Kits (RSK)r
• Type: MCUr

Specifications of R0K561622S000BE

• Contents: Board, Cables, CD, Debugger, Power Supply
• Silicon Manufacturer: Renesas
• Features: Coding And Debugging, E10A Emulator, RS232 Serial Connection
• Kit Contents: Board
• Silicon Family Name: H8SX/1622F
• Silicon Core Number: R5F61622N50LGV
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: H8SX/1622
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Classification
CPU
Interrupt
(sources)
Module/
Function
MCU
operating
mode
Interrupt
controller
(INTC)
Break
interrupt
(UBC)
Description
Mode 1: User boot mode
Mode 2: Boot mode
Mode 4: On-chip ROM disabled external extended mode, 16-bit bus
Mode 5: On-chip ROM disabled external extended mode, 8-bit bus
Mode 6: On-chip ROM enabled external extended mode
Mode 7: Single-chip mode (can be externally extended)
•
•
•
•
•
•
•
•
Low power consumption state (transition driven by the SLEEP
instruction)
Seventeen external interrupt pins (NMI, and IRQ15 to IRQ0)
80 internal interrupt sources
Two interrupt control modes (specified by the interrupt control
register)
Eight priority orders specifiable (by setting the interrupt priority
register)
Independent vector addresses
Break points on four channels
Address break can be set at the CPU instruction fetch cycle
(selected by driving the MD2 and MD1 pins low and driving
the MD0 pin high)
(selected by driving the MD2 and MD0 pins low and driving
the MD1 pin high)
(selected by driving the MD1 and MD0 pins low and driving
the MD2 pin high)
(selected by driving the MD1 pin low and driving the MD2
and MD0 pins high)
(selected by driving the MD0 pin low and driving the MD2
and MD1 pins high)
(selected by driving the MD2, MD1, and MD0 pins high)
Rev. 2.00 Sep. 16, 2009 Page 3 of 1036
Section 1 Overview
REJ09B0414-0200