CC0402JRNP09BN330 Yageo, CC0402JRNP09BN330 Datasheet - Page 13
CC0402JRNP09BN330
Manufacturer Part Number
CC0402JRNP09BN330
Description
CAP CERAMIC 33PF 50V NP0 0402
Manufacturer
Yageo
Series
CCr
Datasheet
1.CC0402JRNP09BN101.pdf
(15 pages)
Specifications of CC0402JRNP09BN330
Capacitance
33pF
Voltage - Rated
50V
Tolerance
±5%
Temperature Coefficient
C0G, NP0
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
0402 (1005 Metric)
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Thickness
0.50mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
0402CG330J9B200
223886915339
311-1020-2
311-1270-2
311-1270-2
CC0402JRNP09BN330B
CC0402JRNPO9BN330
CC0402JRNPO9BN330B
223886915339
311-1020-2
311-1270-2
311-1270-2
CC0402JRNP09BN330B
CC0402JRNPO9BN330
CC0402JRNPO9BN330B
Jan 06, 2011 V6
TEST
Resistance to
soldering heat
Solderability
Rapid change
of
temperature
Surface-Mount Ceramic Multilayer Capacitors
TEST METHOD
IEC 60384-
21/22
4.9
4.10
4.11
PROCEDURE
Precondition: 150 +0/–10 °C for 1 hour, then keep for 24
±1 hours at room temperature
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute
Preheating: for size >1206: 100 °C to 120 °C for 1 minute
and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Preheated the temperature of 80 °C to 140 °C and
maintained for 30 seconds to 60 seconds.
Test conditions for lead containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for lead-free containing solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
Preconditioning;
150 +0/–10 °C for 1 hour, then keep for
24 ±1 hours at room temperature
5 cycles with following detail:
30 minutes at lower category temperature
30 minutes at upper category temperature
Recovery time 24 ±2 hours
General Purpose
REQUIREMENTS
Dissolution of the end face plating shall
not exceed 25% of the length of the
edge concerned
<General purpose series>
∆C/C
Class 1:
NP0: within ±0.5% or 0.5 pF
whichever is greater
D.F. within initial specified value
R
The solder should cover over 95% of
the critical area of each termination
No visual damage
<General purpose series>
∆C/C
Class 1:
NP0: within ±1% or 1 pF
whichever is greater
D.F. meet initial specified value
R
ins
ins
within initial specified value
meet initial specified value
NP0
16 V to 50 V
Product specification
www.yageo.com
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