IRF7401 International Rectifier, IRF7401 Datasheet

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IRF7401

Manufacturer Part Number
IRF7401
Description
MOSFET N-CH 20V 8.7A 8-SOIC
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF7401

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
22 mOhm @ 4.1A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
8.7A
Vgs(th) (max) @ Id
700mV @ 250µA
Gate Charge (qg) @ Vgs
48nC @ 4.5V
Input Capacitance (ciss) @ Vds
1600pF @ 15V
Power - Max
2.5W
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF7401

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Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve the
lowest possible on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient device for use in a wide
variety of applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple
devices can be used in an application with dramatically
reduced board space. The package is designed for
vapor phase, infra red, or wave soldering techniques.
Power dissipation of greater than 0.8W is possible in
a typical PCB mount application.
Absolute Maximum Ratings
Thermal Resistance Ratings
I
I
I
I
P
V
dv/dt
T
D
D
D
DM
R
J,
D
GS
@ T
@ T
@ T
T
Generation V Technology
Ultra Low On-Resistance
N-Channel Mosfet
Surface Mount
Available in Tape & Reel
Dynamic dv/dt Rating
Fast Switching
@T
JA
STG
A
A
A
A
= 25°C
= 25°C
= 70°C
= 25°C
10 Sec. Pulsed Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt ‚
Junction and Storage Temperature Range
Maximum Junction-to-Ambient„
Parameter
Parameter
GS
GS
@ 4.5V
@ 4.5V
GS
@ 4.5V
G
S
S
S
1
2
3
4
T o p V ie w
Typ.
–––
HEXFET
8
6
5
7
-55 to + 150
Max.
D
D
D
0.02
± 12
D
A
A
8.7
7.0
2.5
5.0
35
10
®
R
IRF7401
Power MOSFET
Max.
DS(on)
50
V
DSS
PD - 9.1244C
S O -8
= 0.022
= 20V
Units
°C/W
Units
W/°C
V/ns
W
°C
A
V
02/13/01

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IRF7401 Summary of contents

Page 1

... STG Thermal Resistance Ratings Parameter R Maximum Junction-to-Ambient„ JA HEXFET Max 4.5V GS 0.02 ± 150 Typ. ––– 9.1244C IRF7401 ® Power MOSFET 20V DSS 0.022 DS(on Units 10 8.7 A 7.0 35 2.5 W W/°C V 5.0 V/ns °C Max. Units 50 °C/W 02/13/01 ...

Page 2

... IRF7401 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(ON) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... Fig 3. Typical Transfer Characteristics BOT TOM 1. 0.1 V Fig 2. Typical Output Characteristics 2 6.9A D 1.5 1.0 0.5 0.0 A 4.0 4.5 5.0 -60 - Junction T em perature (°C ) Fig 4. Normalized On-Resistance IRF7401 VGS 7.5V 5.0V 4.0V 3.5V 3.0V 2.5V 2.0V 1.5V 20 µ ° rain-to-S ourc e V oltage ( 4. - ...

Page 4

... IRF7401 rss iss rss rain-to-S ourc e V oltage ( Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage ° 0° 0.1 0.0 1.0 2 ourc e-to-D rain V oltage ( Fig 7. Typical Source-Drain Diode Forward Voltage 100 Single Pulse 0.1 3.0 4.0 Fig 8. Maximum Safe Operating Area = FIG otal G ate C harge ( Fig 6 ...

Page 5

... Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 4.5V Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 125 150 ° 10 d(on) Fig 10b. Switching Time Waveforms Notes: 1. Duty factor Peak 0.01 0 Rectangular Pulse Duration (sec) 1 IRF7401 D.U. µ d(off ...

Page 6

... IRF7401 Charge Fig 12a. Basic Gate Charge Waveform Current Regulator Same Type as D.U.T. 50K .2 F 12V .3 F D.U. 3mA Current Sampling Resistors Fig 12b. Gate Charge Test Circuit + ...

Page 7

... Logic Level and 3V Drive Devices GS Fig 13. For N-Channel HEXFETS Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer „ dv/dt controlled controlled by Duty Factor "D" SD D.U.T. - Device Under Test P. Period [ V =10V GS Current di/dt Diode Recovery dv/ Forward Drop [ ] IRF7401 + * *** ...

Page 8

... IRF7401 Package Outline SO-8 Outline Dimensions are shown in millimeters (inches 0.25 (.010 0.10 (.004 0.25 (.010 CONTROLLING DIMENSION : INCH MOLD PROTRUSIONS NOT TO EXCEED 0.25 (.006 Part Marking Information SO-8 EXAM PLE : 101 IN TER N ATIO N AL F710 TIF IER TOP 45° ATE ( ...

Page 9

... IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ 1.85 (.07 2) 4 1.65 (.06 5) 3 1.60 (. 1.50 (. .55 (. .45 (. 2 8.10 (. 1 7. ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel 451 0111 Data and specifications subject to change without notice. IRF7401 0 .35 (. .25 (. 2. 1. 5.40 (. 1.90 (. 0 ...

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