TDE1897R ST Microelectronics, TDE1897R Datasheet
TDE1897R
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TDE1897R Summary of contents
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... OPEN LOAD DETECTION TWO DIAGNOSTIC OUTPUTS OUTPUT STATUS LED DRIVER DESCRIPTION The TDE1897R/TDE1898R is a monolithic Intelli- gent Power Switch in Multipower BCD Technol- BLOCK DIAGRAM October 1995 This is advanced information on a new product now in development or undergoing evaluation. Details are subject to change without notice. ...
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... TDE1897R - TDE1898R PIN CONNECTIONS (Top view) Minidip SIP9 ABSOLUTE MAXIMUM RATINGS (Minidip pin reference) Symbol V Supply Voltage (Pins – V Supply to Output Differential Voltage. See also Input Voltage (Pins 7/ Differential Input Voltage (Pins Input Current (Pins 7/8) ...
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... C amb V < out oth2 35V 0.5mA diag 3mA diag < V < 15.6 to 35V 5mA diag TDE1897R - TDE1898R Min. Typ. Max. Unit 2 4.5 7 15 0.75 1.5 ...
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... TDE1897R - TDE1898R SOURCE DRAIN NDMOS DIODE Symbol Parameter V 2-3 Forward On Voltage fsd I 2-3 Forward Peak Current fp t 2-3 Reverse Recovery Time rr t 2-3 Forward Recovery Time fr THERMAL CHARACTERISTICS (*) Lim Junction Temp. Protect. T Thermal Hysteresis H SWITCHING CHARACTERISTICS (V t Turn on Delay Time on t Turn off Delay Time ...
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... I O LOAD 3) In normal conditions the operating Junction temperature should remain below 125 C. Figure 2: Inductive Load Equivalent Circuit Figure 3: Demagnetization Cycle Waveforms – Figure 4: Normalized R Temperature 1.8 = RDSON (Tj=25 C) 1.6 1.4 1.2 1.0 0.8 0.6 - TDE1897R - TDE1898R vs. Junction DSON D93IN018 RDSON (Tj 100 125 5/12 ...
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... TDE1897R - TDE1898R WORST CONDITION POWER DISSIPATION IN THE ON-STATE In IPS applications the maximum average power dissipation occurs when the device stays for a long time in the ON state. In such a situation the internal temperature depends on delivered cur- rent (and related power), thermal characteristics of the package and ambient temperature. ...
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... The diagrams, com- puted using parameter values above given, are depicted in figg 180mW increase of the operating area is needed, heat dissipation must be improved (R e.g. by means of air cooling. + CONTROL - LOGIC Ios GND OUTPUT STATUS TDE1897R - TDE1898R , can thj-amb reduced) th +Vs OUTPUT LOAD 7/12 ...
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... TDE1897R - TDE1898R Figure 6: Max. Output Current vs. Ambient Temperature (Minidip Package 100 C/W) th j-amb (mA) 600 500 400 300 200 100 Figure 8: Max. Output Current vs. Ambient Temperature (SIP9 Package C/W) th j-amb (mA) 600 500 400 300 200 100 8/12 Figure 7: Max. Output Current vs. Ambient ...
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... MINIDIP PACKAGE MECHANICAL DATA DIM Min. Typ. A 3.32 a1 0.51 B 1.15 b 0.356 b1 0.204 D E 7.95 e 2.54 e3 7. Max. Min. 0.020 1.65 0.045 0.55 0.014 0.304 0.008 10.92 9.75 0.313 6.6 5.08 3.81 0.125 1.52 TDE1897R - TDE1898R inch Typ. Max. 0.131 0.065 0.022 0.012 0.430 0.384 0.100 0.300 0.300 0260 0.200 0.150 0.060 9/12 ...
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... TDE1897R - TDE1898R SIP9 PACKAGE MECHANICAL DATA DIM. MIN. TYP 2 0. 0. 14.5 e 2.54 e3 20. 10/12 mm MAX. MIN. 7.1 3 0.106 23 24.8 0.5 1.6 0.033 3.3 21.2 0.122 3 0.25 17.85 0.685 3 inch TYP. MAX. 0.280 0.118 0.90 0.976 0.020 0.063 0.130 ...
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... SO20 PACKAGE MECHANICAL DATA DIM. MIN. TYP 0 0. 1.27 e3 11.43 F 7 MAX. MIN. 2.65 0.2 0.004 2.45 0.49 0.014 0.32 0.009 0.5 45 (typ.) 13.0 0.496 10.65 0.394 7.6 0.291 1.27 0.020 0.75 8 (max.) TDE1897R - TDE1898R inch TYP. MAX. 0.104 0.008 0.096 0.019 0.013 0.020 0.510 0.419 0.050 0.450 0.300 0.050 0.030 11/12 ...
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... TDE1897R - TDE1898R Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specification mentioned in this publication are subject to change without notice ...