PESD5V0U4BF,115 NXP Semiconductors, PESD5V0U4BF,115 Datasheet - Page 9

• Manufacturer Part Number: PESD5V0U4BF,115
• Description: DIODE ESD PROTECT VLOW 6-XSON
• Manufacturer: NXP Semiconductors

Specifications of PESD5V0U4BF,115

• Package / Case: 6-XSON (Micropak™), SOT-886
• Voltage - Reverse Standoff (typ): 5V
• Voltage - Breakdown: 5.5V
• Polarization: 4 Channel Array - Bidirectional
• Mounting Type: Surface Mount
• Polarity: Bidirectional
• Channels: 4 Channels
• Breakdown Voltage: 6.5 V
• Termination Style: SMD/SMT
• Capacitance: 2.9 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Dimensions: 0.5 mm W x 1.02 mm L x 0.65 mm H
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4810-2; 934061951115; PESD5V0V4BF,115

NXP Semiconductors
11. Soldering
PESD5V0U4BF_PESD5V0U4BW_1
Product data sheet
Fig 8.
Fig 9.
2
1
0.45
(2 )
Reflow soldering is the only recommended soldering method.
Reflow soldering footprint PESD5V0U4BF (SOT886)
Reflow soldering is the only recommended soldering method.
Reflow soldering footprint PESD5V0U4BW (SOT665)
(2 )
0.7
(2 )
0.4
Ultra low capacitance bidirectional quadruple ESD protection arrays
0.370
0.270
(6 )
(6 )
0.45
(4 )
(4 )
PESD5V0U4BF; PESD5V0U4BW
0.5
Rev. 01 — 15 August 2008
0.325
(6 )
2.45
2.1
1.6
1.7
1.250
0.675
0.425
(6
0.65
0.6
0.500
0.500
0.538
1.700
(5 )
0.4
0.325
0.25
(2 )
0.375
(2 )
0.3
Dimensions in mm
0.55
solder lands
solder paste
occupied area
sot886_fr
Dimensions in mm
© NXP B.V. 2008. All rights reserved.
solder lands
placement area
solder paste
occupied area
sot665_fr
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