LEMC2520T1R0M Taiyo Yuden, LEMC2520T1R0M Datasheet - Page 18

• Manufacturer Part Number: LEMC2520T1R0M
• Description: INDUCTOR WOUND 1.0UH 475MA 1008
• Manufacturer: Taiyo Yuden
• Series: LEr

Specifications of LEMC2520T1R0M

• Inductance: 1µH
• Current: 475mA
• Tolerance: ±20%
• Dc Resistance (dcr): 250 mOhm Max
• Q @ Freq: 20 @ 7.96MHz
• Self Resonant Freq: 180MHz
• Package / Case: 1008 (2520 Metric)
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Frequency - Test: 7.96MHz
• Applications: General Purpose
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Shielding: -
• Current - Saturation: -
• Current - Temperature Rise: -

LER Type，LEM Type，LB Type
PRECAUTIONS
1.Circuit Design
2.PCB Design
3.Considerations for
4.Soldering
5.Cleaning
6.Handling
7.Storage conditions
automatic placement
Stages
Operating environment,
1.The products described in this specification are intended for
Land pattern design
1.Please contact any of our offices for a land pattern, and refer
Adjustment of mounting machine
1.Excessive impact load should not be imposed on the
2.Mounting and soldering conditions should be checked
Wave soldering
1.Please refer to the specifications in the catalog for a wave
Reflow soldering
1.Please contact any of our offices for a reflow soldering, and
2.LER012 Type,LB Type
Reflow solderring only.
Lead free soldering
1.When using products with lead free soldering, we request to
Recommended conditions for using a soldering iron
Cleaning conditions
LB Type
1.Washing by supersonic waves shall be avoided.
Handling
1.Keep the inductors away from all magnets and magnetic
Breakaway PC boards (splitting along perforations)
1.When splitting the PC board after mounting inductors, care
2.Board separation should not be done manually, but by using
Mechanical considerations
1.Please do not give the inductors any excessive mechanical
Storage
1.To maintain the solderability of terminal electrodes and to
・Recommended conditions
Ambient temperature 0∼40℃
Humidity
The ambient temperature must be kept below 30℃ Even under
ideal storage conditions, solderability of products electrodes may
decrease as time passes. For this reason, LE type inductors
should be used within one year from the time of delivery.
LER type, LB type
LE type
use in general electronic equipment,(office supply
equipment,
equipment, and household equipment). They are not
intended for use in mission-critical equipment or systems
requiring special quality and high reliability (traffic systems,
safety equipment, aerospace systems, nuclear control
systems and medical equipment including life-support
systems,) where product failure might result in loss of life,
injury or damage. For such uses, contact TAIYO YUDEN
Sales Department in advance.
to a recommended land pattern of specifications.
products when mounting onto the PC boards.
beforehand.
soldering.
refer to the recommended condition specified.
use them after confirming of adhesion, temperature of
resistance to soldering heat, etc. sufficiently.
objects.
should be taken not to give any stresses of deflection or
twisting to the board.
the appropriate devices.
shocks.
keep the packing material in good condition, temperature
and humidity in the storage area should be controlled.
Please should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be
checked before actual usage.
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350 ℃
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
telecommunications
Precautions
Below 70% RH
systems,
measuring
1. When installing products, care should be taken not to apply distortion stress as it may
1.If products are used beyond the range of the recommended conditions, heat stresses
LB Type
1.If washing by supersonic waves, supersonic waves may cause broken products.
1.There is a case that a characteristic varies with magnetic influence.
1.Planning pattern configurations and the position of products should be carefully
1.There is a case to be damaged by a mechanical shock.
1. Under a high temperature and humidity environment, problems such as reduced
deform the products.
may deform the products, and consequently degrade the reliability of the products.
performed to minimize stress.
solderability caused by oxidation of terminal electrodes and deterioration
of taping/packaging materials may take place.
Technical considerations
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