PIC16C505-04/P Microchip Technology, PIC16C505-04/P Datasheet - Page 76

IC MCU OTP 1KX12 14DIP

PIC16C505-04/P

Manufacturer Part Number
PIC16C505-04/P
Description
IC MCU OTP 1KX12 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets

Specifications of PIC16C505-04/P

Core Size
8-Bit
Program Memory Size
1.5KB (1K x 12)
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
11
Program Memory Type
OTP
Ram Size
72 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
14-DIP (0.300", 7.62mm)
Controller Family/series
PIC16C
No. Of I/o's
12
Ram Memory Size
72Byte
Cpu Speed
4MHz
No. Of Timers
1
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
72 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
11
Number Of Timers
1
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1086 - ADAPTER 14-ZIF BD W/14-SO PLUGS309-1085 - ADAPTER 14-DIP BD W/2 14-SO PLUGAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16C505-04/P
Manufacturer:
MICROCHIP
Quantity:
1 100
Part Number:
PIC16C505-04/P
Manufacturer:
MICROCHIP
Quantity:
5
Part Number:
PIC16C505-04/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16C505
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS40192C-page 76
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-001
Drawing No. C04-005
*Controlling Parameter
n
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
E1
eB
E
Dimension Limits
2
1
c
D
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
A
A1
MIN
.115
.015
.125
.045
.140
.300
.240
.740
.008
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.750
.130
.012
.058
.018
.370
14
10
10
B
B1
MAX
.170
.145
.325
.260
.760
.135
.015
.070
.022
.430
15
15
MIN
18.80
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
p
5
5
MILLIMETERS
NOM
1999 Microchip Technology Inc.
19.05
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
A2
14
10
10
L
MAX
19.30
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15

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