PIC18F14K22-I/SO Microchip Technology, PIC18F14K22-I/SO Datasheet - Page 173
![IC PIC MCU FLASH 512KX16 20-SOIC](/photos/6/64/66480/150-20-soic_sml.jpg)
PIC18F14K22-I/SO
Manufacturer Part Number
PIC18F14K22-I/SO
Description
IC PIC MCU FLASH 512KX16 20-SOIC
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC18LF13K22-ISS.pdf
(388 pages)
3.PIC18LF13K22-ISS.pdf
(12 pages)
4.PIC18LF13K22-ISS.pdf
(36 pages)
5.PIC18F13K22-ISS.pdf
(382 pages)
Specifications of PIC18F14K22-I/SO
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
20-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
17
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
I2C, MSSP, SPI, USART
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
A/d Bit Size
10 bit
A/d Channels Available
12
Height
2.05 mm
Length
12.8 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V, 2.7 V
Width
7.5 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F14K22-I/SO
Manufacturer:
Microchip Technology
Quantity:
1 786
Part Number:
PIC18F14K22-I/SO
Manufacturer:
MIC
Quantity:
20 000
- PIC16F722-ISS PDF datasheet
- PIC18LF13K22-ISS PDF datasheet #2
- PIC18LF13K22-ISS PDF datasheet #3
- PIC18LF13K22-ISS PDF datasheet #4
- PIC18F13K22-ISS PDF datasheet #5
- Current page: 173 of 382
- Download datasheet (6Mb)
14.3.17.3
Bus collision occurs during a Stop condition if:
a)
b)
FIGURE 14-31:
FIGURE 14-32:
© 2009 Microchip Technology Inc.
After the SDA pin has been deasserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
After the SCL pin is deasserted, SCL is sampled
low before SDA goes high.
SDA
SCL
PEN
BCLIF
P
SSPIF
SDA
SCL
PEN
BCLIF
P
SSPIF
Bus Collision During a Stop
Condition
BUS COLLISION DURING A STOP CONDITION (CASE 1)
BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDA asserted low
Assert SDA
T
BRG
T
BRG
Preliminary
T
PIC18F1XK22/LF1XK22
BRG
T
BRG
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD and
counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Figure 14-31). If the SCL pin is
sampled low before SDA is allowed to float high, a bus
collision occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 14-32).
SCL goes low before SDA goes high,
set BCLIF
T
BRG
T
BRG
SDA sampled
low after T
set BCLIF
‘0’
‘0’
DS41365B-page 171
‘0’
‘0’
BRG
,
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