PIC16F72-I/SP Microchip Technology, PIC16F72-I/SP Datasheet - Page 498
PIC16F72-I/SP
Manufacturer Part Number
PIC16F72-I/SP
Description
IC PIC MCU FLASH 2KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F72-ISO.pdf
(136 pages)
5.PIC16F72-ISO.pdf
(6 pages)
6.PIC16F72-ISO.pdf
(136 pages)
Specifications of PIC16F72-I/SP
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C, SPI, SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 5 Channel
Data Rom Size
8 B
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Part Number:
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Manufacturer:
ST
Quantity:
30
Company:
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PIC16F72-I/SP
Manufacturer:
MIC40
Quantity:
55
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Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
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Manufacturer:
MIC
Quantity:
6 264
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F72-ISO PDF datasheet #4
- PIC16F72-ISO PDF datasheet #5
- PIC16F72-ISO PDF datasheet #6
- Current page: 498 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
27.1
DS31027A-page 27-2
Introduction
The device configuration bits allow each user to customize certain aspects of the device to the
needs of the application. When the device powers up, the state of these bits determines the
modes that the device uses. Subsection
uration bits, and the modes that they can be configured to. These bits are mapped in program
memory location 2007h. This location is not accessible during normal device operation (can be
accessed only during programming mode).
The configuration bits can be programmed (read as '0') or left unprogrammed (read as '1') to
select various device configurations. The ability to change these settings once they have been
programmed depends on the memory technology and the package type.
For Read Only Memory (ROM) devices, these bits are specified at time of ROM code submittal
and once the device is masked may not be changed for those devices (would require a new mask
code).
For One Time Programmable (OTP) devices, once these bits are programmed (’0’), they may not
be changed.
For windowed EPROM devices, once these bits are programmed (’0’), the device must be UV
erased to return the configuration word to the erased state. UV erasing the device also erases
the program memory.
For Flash devices, these bits may be erased and reprogrammed.
Note:
Microchip does not recommend code protecting windowed devices.
27.2 “Configuration Word Bits”
1997 Microchip Technology Inc.
discusses the config-
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